Inventor
CHANDOLU ANILKUMAR
US56 patents
⚠️ This page may combine multiple inventors who share the name “CHANDOLU ANILKUMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
45 patentsUS9397078B1Jul 19, 2016
Semiconductor device assembly with underfill containment cavity
MICRON TECHNOLOGY INC24 citations93
US9356009B2May 31, 2016
Interconnect structure with redundant electrical connectors and associated systems and methods
MICRON TECHNOLOGY INC17 citations92
US11233036B2Jan 25, 2022
Interconnect structure with redundant electrical connectors and associated systems and methods
MICRON TECHNOLOGY INC4 citations84
US10943888B2Mar 9, 2021
Interconnect structure with redundant electrical connectors and associated systems and methods
MICRON TECHNOLOGY INC4 citations84
US10566241B1Feb 18, 2020
Methods of forming a semiconductor device, and related semiconductor devices and systems
MICRON TECHNOLOGY INC7 citations84
US10192852B2Jan 29, 2019
Interconnect structure with redundant electrical connectors and associated systems and methods
MICRON TECHNOLOGY INC9 citations84
US9818728B2Nov 14, 2017
Interconnect structure with redundant electrical connectors and associated systems and methods
MICRON TECHNOLOGY INC7 citations84
US9768134B2Sep 19, 2017
Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects
MICRON TECHNOLOGY INC5 citations82
US11444099B2Sep 13, 2022
Microelectronic devices with lower recessed conductive structures and related systems
MICRON TECHNOLOGY INC3 citations73
US10916527B2Feb 9, 2021
Apparatuses and methods for semiconductor die heat dissipation
MICRON TECHNOLOGY INC1 citations73
US10541229B2Jan 21, 2020
Apparatuses and methods for semiconductor die heat dissipation
MICRON TECHNOLOGY INC2 citations73
US11482536B2Oct 25, 2022
Electronic devices comprising memory pillars and dummy pillars including an oxide material, and related systems and methods
MICRON TECHNOLOGY INC2 citations71
US11043412B2Jun 22, 2021
Methods of forming microelectronic devices, and related microelectronic devices and electronic systems
MICRON TECHNOLOGY INC3 citations71
US10276529B2Apr 30, 2019
Semiconductor devices including conductive pillars
MICRON TECHNOLOGY INC2 citations71
US11818888B2Nov 14, 2023
Apparatuses and memory devices including slot structures extending through stack structures
MICRON TECHNOLOGY INC2 citations70
US11437391B2Sep 6, 2022
Methods of forming microelectronic devices, and related microelectronic devices and electronic systems
MICRON TECHNOLOGY INC5 citations70
US11222825B2Jan 11, 2022
Integrated circuitry, memory arrays comprising strings of memory cells, methods used in forming integrated circuitry, and methods used in forming a memory array comprising strings of memory cells
MICRON TECHNOLOGY INC2 citations68
US10886244B2Jan 5, 2021
Collars for under-bump metal structures and associated systems and methods
MICRON TECHNOLOGY INC2 citations66
US9780052B2Oct 3, 2017
Collars for under-bump metal structures and associated systems and methods
MICRON TECHNOLOGY INC3 citations66
US12224240B2Feb 11, 2025
Microelectronic devices including active contacts and support contacts, and related electronic systems and methods
MICRON TECHNOLOGY INC0 citations62
US12191254B2Jan 7, 2025
Electronic devices including tiered stacks including conductive structures isolated by slot structures, and related systems and methods
MICRON TECHNOLOGY INC0 citations62
US12010848B2Jun 11, 2024
Microelectronic devices with lower recessed conductive structures and related methods
MICRON TECHNOLOGY INC0 citations62
US11756826B2Sep 12, 2023
Forming terminations in stacked memory arrays
MICRON TECHNOLOGY INC0 citations62
US11723196B2Aug 8, 2023
Microelectronic devices with support pillars spaced along a slit region between pillar array blocks, and related systems
MICRON TECHNOLOGY INC1 citations62
US11705385B2Jul 18, 2023
Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs)
MICRON TECHNOLOGY INC0 citations62
US11631630B2Apr 18, 2023
Pillar-last methods for forming semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US11626388B2Apr 11, 2023
Interconnect structure with redundant electrical connectors and associated systems and methods
MICRON TECHNOLOGY INC0 citations62
US11417681B2Aug 16, 2022
Memory arrays and methods used in forming a memory array comprising strings of memory cells and operative through-array-vias
MICRON TECHNOLOGY INC0 citations62
US11177279B2Nov 16, 2021
Formation of termination structures in stacked memory arrays
MICRON TECHNOLOGY INC0 citations62
US11121146B2Sep 14, 2021
Forming terminations in stacked memory arrays
MICRON TECHNOLOGY INC0 citations62
US11094592B2Aug 17, 2021
Semiconductor devices and systems comprising memory cells and a source
MICRON TECHNOLOGY INC0 citations62
US11069598B2Jul 20, 2021
Memory arrays and methods used in forming a memory array and conductive through-array-vias (TAVs)
MICRON TECHNOLOGY INC0 citations62
US10985179B2Apr 20, 2021
Memory arrays and methods used in forming a memory array comprising strings of memory cells and operative through-array-vias
MICRON TECHNOLOGY INC0 citations62
US10957625B2Mar 23, 2021
Pillar-last methods for forming semiconductor devices
MICRON TECHNOLOGY INC1 citations62
US10658380B2May 19, 2020
Formation of termination structures in stacked memory arrays
MICRON TECHNOLOGY INC1 citations62
US12041775B2Jul 16, 2024
Electronic devices comprising memory pillars and dummy pillars including an oxide material, and related systems and methods
MICRON TECHNOLOGY INC0 citations61
US11521897B2Dec 6, 2022
Methods of forming microelectronic devices
MICRON TECHNOLOGY INC0 citations61
US11101280B2Aug 24, 2021
Memory arrays and methods used in forming a memory array
MICRON TECHNOLOGY INC1 citations60
US12250821B2Mar 11, 2025
Electronic devices including pillars in array regions and non-array regions
MICRON TECHNOLOGY INC0 citations59
US11871575B2Jan 9, 2024
Electronic devices including pillars in array regions and non-array regions
MICRON TECHNOLOGY INC0 citations59
US11430809B2Aug 30, 2022
Integrated assemblies, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations59
US11387245B2Jul 12, 2022
Electronic devices including pillars in array regions and non-array regions, and related systems and methods
MICRON TECHNOLOGY INC0 citations59
US12087632B2Sep 10, 2024
Integrated circuitry, memory arrays comprising strings of memory cells, methods used in forming integrated circuitry, and methods used in forming a memory array comprising strings of memory cells
MICRON TECHNOLOGY INC0 citations58
US11532638B2Dec 20, 2022
Memory device including multiple decks of memory cells and pillars extending through the decks
MICRON TECHNOLOGY INC0 citations58
US10971409B2Apr 6, 2021
Methods and systems for measuring semiconductor devices
MICRON TECHNOLOGY INC0 citations57
LODESTAR LICENSING GROUP LLC
5 patentsUS12382637B2Aug 5, 2025
Microelectronic devices with lower recessed conductive structures and related methods
LODESTAR LICENSING GROUP LLC0 citations62
US12588212B2Mar 24, 2026
Integrated assemblies, and methods of forming integrated assemblies
LODESTAR LICENSING GROUP LLC0 citations59
US12004351B2Jun 4, 2024
Integrated assemblies, and methods of forming integrated assemblies
LODESTAR LICENSING GROUP LLC0 citations59
US12167599B2Dec 10, 2024
Memory device including multiple decks of memory cells and pillars extending through the decks
LODESTAR LICENSING GROUP LLC0 citations58
US11984364B2May 14, 2024
Methods and systems for measuring semiconductor devices
LODESTAR LICENSING GROUP LLC0 citations57
Showing the top 50 of 56 patents by PatentIndex Score.