P

Inventor

YOON BOUN

KR51 patents
⚠️ This page may combine multiple inventors who share the name “YOON BOUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

37 patents
US10177160B2Jan 8, 2019

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD16 citations91
US9117692B2Aug 25, 2015

Semiconductor device having dual metal silicide layers and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations83
US9006067B2Apr 14, 2015

Semiconductor device and method of fabricationg the same

SAMSUNG ELECTRONICS CO LTD7 citations83
US8859371B2Oct 14, 2014

Method for manufacturing semiconductor device having dual gate dielectric layer

SAMSUNG ELECTRONICS CO LTD16 citations83
US8841769B2Sep 23, 2014

Semiconductor device having metal plug and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations83
US9997412B1Jun 12, 2018

Methods of manufacturing semiconductor devices

SAMSUNG ELECTRONICS CO LTD7 citations82
US8889552B2Nov 18, 2014

Semiconductor device having dual metal silicide layers and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD6 citations78
US9960241B2May 1, 2018

Semiconductor device for manufacturing

SAMSUNG ELECTRONICS CO LTD5 citations73
US10388537B2Aug 20, 2019

Cleaning apparatus, chemical mechanical polishing system including the same, cleaning method after chemical mechanical polishing, and method of manufacturing semiconductor device including the same

SAMSUNG ELECTRONICS CO LTD3 citations71
US9716162B2Jul 25, 2017

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD3 citations71
US10716755B2Jul 21, 2020

Method of fabricating semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations70
US11094586B2Aug 17, 2021

Semiconductor device including interconnections having different structures and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD3 citations69
US10916554B2Feb 9, 2021

Three-dimensional semiconductor memory device

SAMSUNG ELECTRONICS CO LTD2 citations68
US10535533B2Jan 14, 2020

Semiconductor device

SAMSUNG ELECTRONICS CO LTD2 citations66
US11424133B2Aug 23, 2022

Metal structure and method of manufacturing the same and metal wire and semiconductor device and electronic device

SAMSUNG ELECTRONICS CO LTD1 citations62
US10714472B2Jul 14, 2020

Semiconductor devices and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations61
US8796127B2Aug 5, 2014

Methods of fabricating semiconductor devices and semiconductor devices formed thereby

SAMSUNG ELECTRONICS CO LTD2 citations61
US12207457B2Jan 21, 2025

Semiconductor devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations60
US11910594B2Feb 20, 2024

Semiconductor devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations60
US11411004B2Aug 9, 2022

Semiconductor devices and methods of manufacturing the same

SAMSUNG ELECTRONICS CO LTD0 citations60
US10504960B2Dec 10, 2019

Semiconductor memory devices

SAMSUNG ELECTRONICS CO LTD1 citations60
US10566338B2Feb 18, 2020

Three-dimensional semiconductor memory device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD1 citations58
US11222897B2Jan 11, 2022

Semiconductor device and a fabrication method thereof

SAMSUNG ELECTRONICS CO LTD1 citations57
US11186749B2Nov 30, 2021

Slurry composition and method of manufacturing integrated circuit device by using the same

SAMSUNG ELECTRONICS CO LTD0 citations56
US12328870B2Jun 10, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations51
US12598751B2Apr 7, 2026

Semiconductor devices and data storage systems including the same

SAMSUNG ELECTRONICS CO LTD0 citations50
US12501685B2Dec 16, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations50
US12490424B2Dec 2, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations47
US12581657B2Mar 17, 2026

Semiconductor devices and data storage systems including the same

SAMSUNG ELECTRONICS CO LTD0 citations46
US12551982B2Feb 17, 2026

Polishing pad and substrate processing apparatus including the same

SAMSUNG ELECTRONICS CO LTD0 citations46
US12400907B2Aug 26, 2025

Semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations46
US12394691B2Aug 19, 2025

Semiconductor devices and data storage systems including the same

SAMSUNG ELECTRONICS CO LTD0 citations45
US11765880B2Sep 19, 2023

Method of manufacturing semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations45
US12464795B2Nov 4, 2025

Method of manufacturing semiconductor device using single slurry chemical mechanical polishing (CMP) process

SAMSUNG ELECTRONICS CO LTD0 citations44
US12513982B2Dec 30, 2025

Semiconductor device having an isolation structure between adjacent source/drain regions

SAMSUNG ELECTRONICS CO LTD0 citations43
US11757015B2Sep 12, 2023

Semiconductor devices

SAMSUNG ELECTRONICS CO LTD0 citations42
US10153214B2Dec 11, 2018

Patterning method and a method of fabricating a semiconductor device using the same

SAMSUNG ELECTRONICS CO LTD0 citations41

CHOI SUKHUN

4 patents

PARK SANGJINE

3 patents

LEE HYOSAN

1 patent

LEE JONGWON

1 patent

KIM YOUNG-HOO

1 patent

KWON KEE SANG

1 patent

KIM KI WOONG

1 patent

KIM YOUNGOK

1 patent

Showing the top 50 of 51 patents by PatentIndex Score.