Inventor

SHOBHA HOSADURGA

US84 patents

⚠️ This page may combine multiple inventors who share the name “SHOBHA HOSADURGA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHOBHA HOSADURGA

IBM

Void-free metallic interconnect structures with self-formed diffusion barrier layers

Integration of super via structure in BEOL

Integration of super via structure in BEOL

Selective and non-selective barrier layer wet removal

SiCOH hardmask with graded transition layers

Advanced multilayer dielectric cap with improved mechanical and electrical properties

Acid-cleavable acetal and ketal based epoxy oligomers

Barrier-less prefilled via formation

Selective and non-selective barrier layer wet removal

Selective and non-selective barrier layer wet removal

Interconnect structure containing a porous low k interconnect dielectric/dielectric cap

Method for fabricating air gap interconnect structures

Treatment of plasma damaged layer for critical dimension retention, pore sealing and repair

Underfilling with acid-cleavable acetal and ketal epoxy oligomers

Backside floating metal for increased capacitance

Tall trenches for via chamferless and self forming barrier

Metallization interconnect structure formation

Semiconductor device with selective insulator for improved capacitance

Method and structure to construct cylindrical interconnects to reduce resistance

Selective ILD deposition for fully aligned via with airgap

Robust high performance low hydrogen silicon carbon nitride (SiCNH) dielectrics for nano electronic devices

Hydrogen-free silicon-based deposited dielectric films for nano device fabrication

Contact structure for power delivery on semiconductor device

Skip-level TSV with hybrid dielectric scheme for backside power delivery

Hybrid buried power rail structure with dual front side and backside processing

Dual structured buried rail

Isolation rail between backside power rails

Backside power plane

Dielectric caps for power and signal line routing

Top via patterning using metal as hard mask and via conductor

Barrier-less prefilled via formation

Skip via connection between metallization levels

Method and structure to construct cylindrical interconnects to reduce resistance

Multi-buried ULK field in BEOL structure

Interconnect structure with an oxygen-doped SiC antireflective coating and method of fabrication

Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same

Semiconductor capacitor

Selective deposition on metals using porous low-k materials

Bottom barrier free interconnects without voids

Interconnects with gouged vias

Bottom barrier free interconnects without voids

Void-free metallic interconnect structures with self-formed diffusion barrier layers

NGUYEN SON VAN

Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures

Method of forming an interconnect structure

TESSERA LLC

Method of forming copper interconnect structure with manganese barrier layer

Selective ILD deposition for fully aligned via with airgap

CHANDA KAUSHIK

Air gap interconnect structures and methods for forming the same

LIN QINGHUANG

Self-aligned fine pitch permanent on-chip interconnect structures and method of fabrication

ADEIA SEMICONDUCTOR SOLUTIONS LLC

Selective ILD deposition for fully aligned via with airgap

TESSERA INC

Selective ILD deposition for fully aligned via with airgap