Inventor · disambiguated record
Matthew Kaufmann
Also filed as: KAUFMANN MATTHEW · KAUFMANN MATTHEW V · KAUFMANN MATTHEW VERNON
11 granted patents·6 pending applications·143 citations·filing 2005–2014
89Inventor score
Top patents by PatentIndex Score
17 records- 0197US8890298B2Embedded package security tamper meshBROADCOM CORP·Filed 2013·Granted Nov 18, 2014·73 cites·8 claims
- 0291US10043924B1Low cost optical sensor packageMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Aug 7, 2018·15 cites·15 claims
- 0389US8502396B2Embedded package security tamper meshBUER MARK·Filed 2008·Granted Aug 6, 2013·16 cites·20 claims
- 0482US7872347B2Larger than die size wafer-level redistribution packaging processBROADCOM CORP·Filed 2007·Granted Jan 18, 2011·9 cites·11 claims
- 0576US8643164B2Package-on-package technology for fan-out wafer-level packagingKAUFMANN MATTHEW VERNON·Filed 2009·Granted Feb 4, 2014·13 cites·20 claims
- 0675US7834449B2Highly reliable low cost structure for wafer-level ball grid array packagingBROADCOM CORP·Filed 2007·Granted Nov 16, 2010·9 cites·25 claims
- 0772US8508054B2Enhanced bump pitch scalingPANG MENGZHI·Filed 2011·Granted Aug 13, 2013·4 cites·22 claims
- 0864US8957516B2Low cost and high performance flip chip packageBROADCOM CORP·Filed 2014·Granted Feb 17, 2015·2 cites·20 claims
- 0958US7449365B2Wafer-level flipchip package with IC circuit isolationBROADCOM CORP·Filed 2006·Granted Nov 11, 2008·2 cites·25 claims
- 1054US2015137340A1Embedded package security tamper meshBROADCOM CORP·Filed 2014·Application pending·0 cites
- 1145US2009230554A1Wafer-level redistribution packaging with die-containing openingsBROADCOM CORP·Filed 2009·Application pending·0 cites
- 1241US8269321B2Low cost lead frame package and method for forming sameWANG KEN JIAN MING·Filed 2007·Granted Sep 18, 2012·0 cites·19 claims
- 1341US2008315436A1Semiconductor wafer that supports multiple packaging techniquesBROADCOM CORP·Filed 2007·Application pending·0 cites
- 1439US2007102815A1Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layerKAUFMANN MATTHEW V·Filed 2005·Application pending·0 cites
- 1539US2013187284A1Low Cost and High Performance Flip Chip PackagePANG MENGZHI·Filed 2012·Application pending·0 cites
- 1635US8749011B2System and method for reducing voltage drops in integrated circuitsKAUFMANN MATTHEW·Filed 2005·Granted Jun 10, 2014·0 cites·25 claims
- 1732US2012256305A1Integrated Circuit Package Security FenceKAUFMANN MATTHEW·Filed 2011·Application pending·0 cites
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