Inventor
NAKAO KEN
JP43 patents
⚠️ This page may combine multiple inventors who share the name “NAKAO KEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
14 patentsUS5813851ASep 29, 1998
Heat treatment method
TOKYO ELECTRON LTD496 citations99
US6062853AMay 16, 2000
Heat-treating boat for semiconductor wafers
TOKYO ELECTRON LTD111 citations98
US7072578B2Jul 4, 2006
Carbon wire heating object sealing heater and fluid heating apparatus using the same heater
TOKYO ELECTRON LTD44 citations95
US6008477ADec 28, 1999
Heat treatment apparatus
TOKYO ELECTRON LTD27 citations92
US6885814B2Apr 26, 2005
Carbon wire heating object sealing heater and fluid heating apparatus using the same heater
TOKYO ELECTRON LTD36 citations91
US5645419AJul 8, 1997
Heat treatment method and device
TOKYO ELECTRON LTD31 citations91
US5500388AMar 19, 1996
Heat treatment process for wafers
TOKYO ELECTRON LTD26 citations90
US7888622B2Feb 15, 2011
Heat-processing furnace and manufacturing method thereof
TOKYO ELECTRON LTD8 citations84
US7311520B2Dec 25, 2007
Heat treatment apparatus
TOKYO ELECTRON LTD17 citations84
US7102104B2Sep 5, 2006
Heat treatment system
TOKYO ELECTRON LTD14 citations84
US8033823B2Oct 11, 2011
Heat processing apparatus
TOKYO ELECTRON LTD5 citations63
US7862638B2Jan 4, 2011
Gas supply system for semiconductor manufacturing apparatus
TOKYO ELECTRON LTD2 citations63
US7807587B2Oct 5, 2010
Substrate processing apparatus and substrate processing method
TOKYO ELECTRON LTD5 citations63
US7150628B2Dec 19, 2006
Single-wafer type heat treatment apparatus for semiconductor processing system
TOKYO ELECTRON LTD5 citations63
TEL SAGAMI LTD
12 patentsUS5097890AMar 24, 1992
Heat treating apparatus with cooling fluid nozzles
TEL SAGAMI LTD421 citations99
US5324920AJun 28, 1994
Heat treatment apparatus
TEL SAGAMI LTD42 citations93
US4937434AJun 26, 1990
Heat treatment apparatus and heat treatment method
TEL SAGAMI LTD30 citations93
US4943235AJul 24, 1990
Heat-treating apparatus
TEL SAGAMI LTD23 citations92
US4938691AJul 3, 1990
Heat-treating apparatus
TEL SAGAMI LTD38 citations92
US5239614AAug 24, 1993
Substrate heating method utilizing heating element control to achieve horizontal temperature gradient
TEL SAGAMI LTD27 citations89
US5234501AAug 10, 1993
Oxidation metod
TEL SAGAMI LTD22 citations88
US5229576AJul 20, 1993
Heating apparatus
TEL SAGAMI LTD20 citations81
USD326272SMay 19, 1992
Heat insulating cylinder for thermal treatment of semiconductor wafers
TEL SAGAMI LTD9 citations74
USD326273SMay 19, 1992
Heat insulating cylinder for thermal treatment of semiconductor wafers
TEL SAGAMI LTD7 citations73
US5323484AJun 21, 1994
Heating apparatus with multilayer insulating structure
TEL SAGAMI LTD14 citations72
USD327078SJun 16, 1992
Instrument for transferring boats for thermal treatment of semiconductor wafers
TEL SAGAMI LTD2 citations62
TOSHIBA CERAMICS CO
5 patentsUS6407371B1Jun 18, 2002
Heater
TOSHIBA CERAMICS CO106 citations96
US6043468AMar 28, 2000
Carbon heater
TOSHIBA CERAMICS CO114 citations96
US6204488B1Mar 20, 2001
Sealing terminal
TOSHIBA CERAMICS CO23 citations91
US6584279B2Jun 24, 2003
Heater sealed with carbon wire heating element
TOSHIBA CERAMICS CO15 citations82
US6515264B2Feb 4, 2003
Heater
TOSHIBA CERAMICS CO8 citations72
NAKAO KEN
4 patentsUS8167521B2May 1, 2012
Substrate transfer apparatus and vertical heat processing apparatus
NAKAO KEN11 citations83
US8197600B2Jun 12, 2012
Vaporizer and semiconductor processing system
NAKAO KEN6 citations71
US8470720B2Jun 25, 2013
Film forming apparatus and film forming method
NAKAO KEN4 citations62
US8546185B2Oct 1, 2013
Method for manufacturing semiconductor device
NAKAO KEN0 citations50