USD326273SExpiredUtility

Heat insulating cylinder for thermal treatment of semiconductor wafers

55
Assignee: TEL SAGAMI LTDPriority: Jul 25, 1988Filed: Jan 25, 1989Granted: May 19, 1992
Est. expiryJul 25, 2008(expired)· nominal 20-yr term from priority
Inventors:Ken NakaoSeishiro SatoWataru Ohkase
55
PatentIndex Score
7
Cited by
7
References
1
Claims

Claims

exact text as granted — not AI-modified
The ornamental design for a heat insulating cylinder for thermal treatment of semiconductor wafers, as shown and described.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.