Inventor

ENOMOTO TETSUYA

JP30 patents

⚠️ This page may combine multiple inventors who share the name “ENOMOTO TETSUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ENOMOTO TETSUYA

SANYO ELECTRIC CO

Stereoscopic image display apparatus capable of selectively displaying desired stereoscopic image

Image information presentation system, image information presentation method, medium storing image information presentation system program, and signal therefor

Panel-presentation-software creation method, computer-readable record medium recording a panel-presentation-software creation program, and panel-presentation-software creation device

Apparatus for producing a three dimensional image from a two dimensional image

Method of converting two-dimensional image into three-dimensional image

Method of converting two dimensional images into three-dimensional images

Photodetector for receiving an index signal of a beam-index cathode-ray tube

HITACHI CHEMICAL CO LTD

Wiring board, semiconductor device, and method of manufacturing wiring board

Production method of semiconductor device and bonding film

Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Method of manufacturing wiring substrate

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD

Photosensitive resin composition, method of manufacturing pattern cured product, cured product, interlayer insulating film, cover-coat layer, surface protective film, and electronic component

Polymide precursor resin composition

Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition

Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component

DENSO CORP

Piezoelectric film layered structure and method for producing thereof

Electroacoustic transducer

Microelectromechanical systems device

HD MICROSYSTEMS LTD

Method for producing polyimide precursor, method for producing photosensitive resin composition, method for producing pattern cured product, method for producing interlayer insulating film, cover coat layer or surface protective film, and method for producing electronic component

Photosensitive resin composition, method for producing patterned cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component

Photosensitive resin composition, method of manufacturing pattern cured film, cured film, interlayer insulating film, cover coat layer, surface protective film, and electronic component

HONDA KAZUTAKA

Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

NISSAN MOTOR

Resinous tube

HITACHI LTD

Color cathode ray tube having an internal voltage divider

HITACHI DISPLAYS LTD

Liquid crystal display device

RESONAC CORP

Temporary fixation layered film and production method therefor, temporary fixation layered body, and semiconductor device production method

ENOMOTO TETSUYA

Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device