Inventor
KATA KEIICHIRO
JP21 patents
⚠️ This page may combine multiple inventors who share the name “KATA KEIICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
17 patentsUS5897337AApr 27, 1999
Process for adhesively bonding a semiconductor chip to a carrier film
NEC CORP182 citations99
US5844304ADec 1, 1998
Process for manufacturing semiconductor device and semiconductor wafer
NEC CORP120 citations98
US5726489AMar 10, 1998
Film carrier semiconductor device
NEC CORP95 citations98
US5683942ANov 4, 1997
Method for manufacturing bump leaded film carrier type semiconductor device
NEC CORP133 citations97
US7397000B2Jul 8, 2008
Wiring board and semiconductor package using the same
NEC CORP54 citations96
US5905303AMay 18, 1999
Method for manufacturing bump leaded film carrier type semiconductor device
NEC CORP77 citations95
US5759873AJun 2, 1998
Method of manufacturing chip-size package-type semiconductor device
NEC CORP63 citations94
US7566834B2Jul 28, 2009
Wiring board and semiconductor package using the same
NEC CORP17 citations92
US6339337B1Jan 15, 2002
Method for inspecting semiconductor chip bonding pads using infrared rays
NEC CORP26 citations92
US6201298B1Mar 13, 2001
Semiconductor device using wiring tape
NEC CORP24 citations92
US5757068AMay 26, 1998
Carrier film with peripheral slits
NEC CORP25 citations92
US6114754ASep 5, 2000
Tape automated bonding film
NEC CORP16 citations84
US5977617ANov 2, 1999
Semiconductor device having multilayer film carrier
NEC CORP14 citations74
US5292574AMar 8, 1994
Ceramic substrate having wiring of silver series
NEC CORP17 citations74
US5283081AFeb 1, 1994
Process for manufacturing a ceramic wiring substrate having a low dielectric constant
NEC CORP18 citations74
US5283210AFeb 1, 1994
Low temperature sintering low dielectric inorganic composition
NEC CORP9 citations74
US7816782B2Oct 19, 2010
Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package
NEC CORP4 citations62
NEC ELECTRONICS CORP
3 patentsUS7060604B2Jun 13, 2006
Multilayer wiring substrate, and method of producing same
NEC ELECTRONICS CORP21 citations92
USRE39603EMay 1, 2007
Process for manufacturing semiconductor device and semiconductor wafer
NEC ELECTRONICS CORP10 citations83
US7233066B2Jun 19, 2007
Multilayer wiring substrate, and method of producing same
NEC ELECTRONICS CORP8 citations73