Inventor · disambiguated record
Boung Ju Lee
Also filed as: LEE BOUNG JU
5 granted patents·1 pending application·34 citations·filing 1996–2019
76Inventor score
Files withSAMSUNG ELECTRONICS CO LTD2HYUNDAI ELECTRONICS IND1KOREA ADVANCED INST SCI & TECH1LEE BOUNG JU1LEE SE-YOUNG1
Top patents by PatentIndex Score
6 records- 0185US7550822B2Dual-damascene metal wiring patterns for integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 23, 2009·13 cites·9 claims
- 0260US7786520B2Embedded semiconductor device including planarization resistance patterns and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 31, 2010·2 cites·7 claims
- 0356US8263454B2Embedded semiconductor device including planarization resistance patterns and method of manufacturing the sameLEE SE-YOUNG·Filed 2010·Granted Sep 11, 2012·1 cites·10 claims
- 0451US11530129B2MEMs membrane structure and method of fabricating sameKOREA ADVANCED INST SCI & TECH·Filed 2019·Granted Dec 20, 2022·0 cites·6 claims
- 0550US2012193322A9Methods of Forming Dual-Damascene Metal Wiring Patterns for Integrated Circuit Devices and Wiring Patterns Formed TherebyLEE BOUNG JU·Filed 2009·Application pending·0 cites
- 0641US5905667AFull adder using NMOS transistorHYUNDAI ELECTRONICS IND·Filed 1996·Granted May 18, 1999·18 cites·7 claims
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