Inventor · disambiguated record
Ludovico E. Bancod
Also filed as: BANCOD LUDOVICO · BANCOD LUDOVICO E · BANCOD LUDOVICO ESTRADA
20 granted patents·2 pending applications·961 citations·filing 1993–2024
96Inventor score
Files withAMKOR TECHNOLOGY INC12AMKOR TECH SINGAPORE HOLDING PTE LTD4DARVEAUX ROBERT FRANCIS2BANCOD LUDOVICO E1CROWLEY SEAN T1
Top patents by PatentIndex Score
22 records- 0197US11488934B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·5 cites·20 claims
- 0295US6608366B1Lead frame with plated end leadsFiled 2002·Granted Aug 19, 2003·152 cites·21 claims
- 0394US10872879B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 22, 2020·9 cites·20 claims
- 0494US10163867B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 25, 2018·15 cites·20 claims
- 0594US8536462B1Flex circuit package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Sep 17, 2013·41 cites·20 claims
- 0694US7008825B1Leadframe strip having enhanced testabilityAMKOR TECHNOLOGY INC·Filed 2003·Granted Mar 7, 2006·114 cites·21 claims
- 0794US6258629B1Electronic device package and leadframe and method for making the packageAMKOR TECHNOLOGY INC·Filed 1999·Granted Jul 10, 2001·213 cites·39 claims
- 0893US8300423B1Stackable treated via package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Oct 30, 2012·18 cites·19 claims
- 0992US6339252B1Electronic device package and leadframeAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 15, 2002·82 cites·45 claims
- 1091US6841414B1Saw and etch singulation method for a chip packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Jan 11, 2005·87 cites·16 claims
- 1188US6611047B2Semiconductor package with singulation creaseAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 26, 2003·58 cites·14 claims
- 1286US5370446AHeadrest with side supportsFiled 1993·Granted Dec 6, 1994·74 cites·4 claims
- 1385US7485491B1Secure digital memory card using land grid array structureAMKOR TECHNOLOGY INC·Filed 2006·Granted Feb 3, 2009·10 cites·20 claims
- 1484US7112875B1Secure digital memory card using land grid array structureAMKOR TECHNOLOGY INC·Filed 2005·Granted Sep 26, 2006·10 cites·20 claims
- 1583US9875980B2Copper pillar sidewall protectionAMKOR TECHNOLOGY INC·Filed 2014·Granted Jan 23, 2018·6 cites·15 claims
- 1682US2024395771A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1780US6847099B1Offset etched corner leads for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2003·Granted Jan 25, 2005·32 cites·21 claims
- 1878US6885086B1Reduced copper lead frame for saw-singulated chip packageAMKOR TECHNOLOGY INC·Filed 2002·Granted Apr 26, 2005·29 cites·20 claims
- 1977US12057434B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
- 2053US7598598B1Offset etched corner leads for semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Oct 6, 2009·6 cites·20 claims
- 2139US8338229B1Stackable plasma cleaned via package and methodBANCOD LUDOVICO E·Filed 2010·Granted Dec 25, 2012·0 cites·15 claims
- 2237US2007176287A1Thin integrated circuit device packages for improved radio frequency performanceCROWLEY SEAN T·Filed 2004·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →