Inventor
MICHII KAZUNARI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “MICHII KAZUNARI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
23 patentsUS5252853AOct 12, 1993
Packaged semiconductor device having tab tape and particular power distribution lead structure
MITSUBISHI ELECTRIC CORP402 citations99
US6353265B1Mar 5, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP144 citations98
US6545366B2Apr 8, 2003
Multiple chip package semiconductor device
MITSUBISHI ELECTRIC CORP114 citations97
US6445064B1Sep 3, 2002
Semiconductor device
MITSUBISHI ELECTRIC CORP93 citations97
US5373188ADec 13, 1994
Packaged semiconductor device including multiple semiconductor chips and cross-over lead
MITSUBISHI ELECTRIC CORP50 citations93
US5303120AApr 12, 1994
Method of manufacturing inversion type IC's and IC module using same
MITSUBISHI ELECTRIC CORP39 citations93
US6670701B2Dec 30, 2003
Semiconductor module and electronic component
MITSUBISHI ELECTRIC CORP48 citations92
USD475981SJun 17, 2003
Integrated circuits substrate
MITSUBISHI ELECTRIC CORP33 citations92
US5508232AApr 16, 1996
Method of manufacturing a semiconductor device
MITSUBISHI ELECTRIC CORP20 citations92
US5334803AAug 2, 1994
Semiconductor device and method of producing the same
MITSUBISHI ELECTRIC CORP40 citations92
US5196917AMar 23, 1993
Carrier tape
MITSUBISHI ELECTRIC CORP26 citations92
US5105257AApr 14, 1992
Packaged semiconductor device and semiconductor device packaging element
MITSUBISHI ELECTRIC CORP54 citations92
US5067005ANov 19, 1991
Semiconductor device
MITSUBISHI ELECTRIC CORP26 citations92
US5053855AOct 1, 1991
Plastic molded-type semiconductor device
MITSUBISHI ELECTRIC CORP34 citations92
US6583511B2Jun 24, 2003
Semiconductor device and a method of producing the same
MITSUBISHI ELECTRIC CORP13 citations83
US6323545B1Nov 27, 2001
Semiconductor device
MITSUBISHI ELECTRIC CORP10 citations74
USRE36077EFeb 2, 1999
Method of manufacturing inversion type IC's and IC module using same
MITSUBISHI ELECTRIC CORP13 citations74
US5424577AJun 13, 1995
Lead frame for semiconductor device
MITSUBISHI ELECTRIC CORP18 citations74
US6552418B2Apr 22, 2003
Resin-encapsulated semiconductor device
MITSUBISHI ELECTRIC CORP8 citations73
US5220196AJun 15, 1993
Semiconductor device
MITSUBISHI ELECTRIC CORP16 citations73
US6614101B2Sep 2, 2003
Lead frame with raised leads and plastic packaged semiconductor device using the same
MITSUBISHI ELECTRIC CORP8 citations71
US6518652B2Feb 11, 2003
Semiconductor package
MITSUBISHI ELECTRIC CORP10 citations71
USRE35496EApr 29, 1997
Semiconductor device and method of producing the same
MITSUBISHI ELECTRIC CORP3 citations62
RENESAS TECH CORP
7 patentsUS6836007B2Dec 28, 2004
Semiconductor package including stacked semiconductor chips
RENESAS TECH CORP80 citations98
US6858938B2Feb 22, 2005
Semiconductor device
RENESAS TECH CORP23 citations92
US6798056B2Sep 28, 2004
Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package
RENESAS TECH CORP8 citations73
US6737733B2May 18, 2004
Sealed semiconductor device and lead frame used for the same
RENESAS TECH CORP2 citations62
US7166490B2Jan 23, 2007
Semiconductor device with terminals, and method of manufacturing the same
RENESAS TECH CORP4 citations61
US6836004B2Dec 28, 2004
Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame
RENESAS TECH CORP2 citations61
US7348191B2Mar 25, 2008
Semiconductor device with terminals, and method of manufacturing the same
RENESAS TECH CORP0 citations50