Inventor

MIN TAE-HONG

KR64 patents

⚠️ This page may combine multiple inventors who share the name “MIN TAE-HONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MIN TAE-HONG

SAMSUNG ELECTRO MECH

Electronic component package and package-on-package structure including the same

Coil component and method of manufacturing the same

Antenna module

Printed circuit board and package including printed circuit board

Printed circuit board and package having the same

Circuit board and manufacturing method thereof

Circuit board

Circuit board

Circuit board including heat dissipation structure

Printed circuit board

Printed circuit board and antenna module comprising the same

Printed circuit board and antenna module comprising the same

Printed circuit board

Printed circuit board

Circuit board and circuit board assembly

Inductor device and method of manufacturing the same

Connection structure embedded substrate and substrate structure including the same

Printed circuit board

Printed circuit board

Connection structure embedded substrate and substrate structure including the same

Printed circuit board and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD

Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same

Semiconductor package

Semiconductor package having a high reliability

Semiconductor package having recessed adhesive layer between stacked chips

Semiconductor package having a high reliability

Semiconductor package and method of manufacturing the same

Semiconductor package having a high reliability

Semiconductor package having a high reliability

Semiconductor package having a high reliability

Method of manufacturing semiconductor device

Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same

Multi-chip package and method of manufacturing the same

Semiconductor package having a high reliability

Semiconductor packages

Digital photographing apparatus, method of controlling the digital photographing apparatus, and recording medium storing program to implement the method

LEE CHUNG-SUN

Semiconductor device including a stack of semiconductor chips, underfill material and molding material

Stack package and semiconductor package including the same

CHOI EUN-KYOUNG

Semiconductor packages and methods of fabricating the same

Semiconductor packages and methods of fabricating the same

KANG UN-BYOUNG

Semiconductor device and method of forming the same

Multi-chip package and method of manufacturing the same

JEE YOUNG-KUN

Chip-stacked semiconductor package

LEE GO EUN

Semiconductor apparatus having through vias configured to isolate power supplied to a memory chip from data signals supplied to the memory chip

LEE HO-JIN

Multi-layer TSV insulation and methods of fabricating the same

KWAK BYOUNG SOO

Semiconductor device including multiple semiconductor chips

JANG SOON-GEUN

Image processing method and image processing apparatus

CHOE YEONG HWAN

Semiconductor device having stacked semiconductor chips interconnected via TSV

KIM JI HWANG

Semiconductor device and method of manufacturing the same

MYUNG JONG-YUN

Method of forming semiconductor device