P

Inventor

SLINKMAN JAMES A

US67 patents
⚠️ This page may combine multiple inventors who share the name “SLINKMAN JAMES A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

40 patents
US5065103ANov 12, 1991

Scanning capacitance - voltage microscopy

IBM93 citations96
US6198300B1Mar 6, 2001

Silicided silicon microtips for scanning probe microscopy

IBM87 citations95
US7999320B2Aug 16, 2011

SOI radio frequency switch with enhanced signal fidelity and electrical isolation

IBM21 citations93
US7585614B2Sep 8, 2009

Sub-lithographic imaging techniques and processes

IBM28 citations93
US6139759AOct 31, 2000

Method of manufacturing silicided silicon microtips for scanning probe microscopy

IBM53 citations93
US9324628B2Apr 26, 2016

Integrated circuit heat dissipation using nanostructures

IBM8 citations92
US6887798B2May 3, 2005

STI stress modification by nitrogen plasma treatment for improving performance in small width devices

IBM16 citations92
US6441396B1Aug 27, 2002

In-line electrical monitor for measuring mechanical stress at the device level on a semiconductor wafer

IBM36 citations92
US5547894AAug 20, 1996

CMOS processing with low and high-current FETs

IBM20 citations92
US6445050B1Sep 3, 2002

Symmetric device with contacts self aligned to gate

IBM24 citations91
US6417515B1Jul 9, 2002

In-situ ion implant activation and measurement apparatus

IBM38 citations91
US7883990B2Feb 8, 2011

High resistivity SOI base wafer using thermally annealed substrate

IBM29 citations89
US10629710B2Apr 21, 2020

Integrated circuit heat dissipation using nanostructures

IBM3 citations84
US10109553B2Oct 23, 2018

Integrated circuit heat dissipation using nanostructures

IBM4 citations84
US10068827B2Sep 4, 2018

Integrated circuit heat dissipation using nanostructures

IBM5 citations84
US9601606B2Mar 21, 2017

Integrated circuit heat dissipation using nanostructures

IBM7 citations84
US8026131B2Sep 27, 2011

SOI radio frequency switch for reducing high frequency harmonics

IBM9 citations84
US7479688B2Jan 20, 2009

STI stress modification by nitrogen plasma treatment for improving performance in small width devices

IBM11 citations84
US6417070B1Jul 9, 2002

Method for forming a liner in a trench

IBM15 citations84
US9653477B2May 16, 2017

Single-chip field effect transistor (FET) switch with silicon germanium (SiGe) power amplifier and methods of forming

IBM6 citations83
US9646993B2May 9, 2017

Single-chip field effect transistor (FET) switch with silicon germanium (SiGe) power amplifier and methods of forming

IBM7 citations83
US6946376B2Sep 20, 2005

Symmetric device with contacts self aligned to gate

IBM15 citations82
US6967380B2Nov 22, 2005

CMOS device having retrograde n-well and p-well

IBM6 citations74
US10600893B2Mar 24, 2020

Integrated circuit heat dissipation using nanostructures

IBM2 citations73
US9704978B2Jul 11, 2017

Integrated circuit heat dissipation using nanostructures

IBM2 citations73
US9666701B2May 30, 2017

Integrated circuit heat dissipation using nanostructures

IBM2 citations73
US9530711B2Dec 27, 2016

Silicon-on-insulator heat sink

IBM4 citations73
US9059269B2Jun 16, 2015

Silicon-on-insulator heat sink

IBM4 citations73
US6946710B2Sep 20, 2005

Method and structure to reduce CMOS inter-well leakage

IBM7 citations73
US6686252B2Feb 3, 2004

Method and structure to reduce CMOS inter-well leakage

IBM9 citations73
US6649429B2Nov 18, 2003

In-line electrical monitor for measuring mechanical stress at the device level on a semiconductor wafer

IBM9 citations73
US6274465B1Aug 14, 2001

DC electric field assisted anneal

IBM5 citations73
US8951896B2Feb 10, 2015

High linearity SOI wafer for low-distortion circuit applications

IBM4 citations71
US7302376B2Nov 27, 2007

Device modeling for proximity effects

IBM7 citations69
US9214561B2Dec 15, 2015

Thin body switch transistor

IBM3 citations63
US8709903B2Apr 29, 2014

Silicon-on-insulator (SOI) structure configured for reduced harmonics and method of forming the structure

IBM1 citations63
US7442996B2Oct 28, 2008

Structure and method for enhanced triple well latchup robustness

IBM3 citations63
US6875685B1Apr 5, 2005

Method of forming gas dielectric with support structure

IBM5 citations63
US11152495B2Oct 19, 2021

Integrated circuit heat dissipation using nanostructures

IBM0 citations62
US11081572B2Aug 3, 2021

Integrated circuit heat dissipation using nanostructures

IBM0 citations62

BOTULA ALAN B

6 patents

GRECO JOSEPH R

1 patent

GLOBALFOUNDRIES INC

1 patent

INTERNAT BUSINESS MACHINES MAC

1 patent

ABOU-KHALIL MICHEL J

1 patent

Showing the top 50 of 67 patents by PatentIndex Score.