Inventor
SLINKMAN JAMES A
US67 patents
⚠️ This page may combine multiple inventors who share the name “SLINKMAN JAMES A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
40 patentsUS5065103ANov 12, 1991
Scanning capacitance - voltage microscopy
IBM93 citations96
US6198300B1Mar 6, 2001
Silicided silicon microtips for scanning probe microscopy
IBM87 citations95
US7999320B2Aug 16, 2011
SOI radio frequency switch with enhanced signal fidelity and electrical isolation
IBM21 citations93
US7585614B2Sep 8, 2009
Sub-lithographic imaging techniques and processes
IBM28 citations93
US6139759AOct 31, 2000
Method of manufacturing silicided silicon microtips for scanning probe microscopy
IBM53 citations93
US9324628B2Apr 26, 2016
Integrated circuit heat dissipation using nanostructures
IBM8 citations92
US6887798B2May 3, 2005
STI stress modification by nitrogen plasma treatment for improving performance in small width devices
IBM16 citations92
US6441396B1Aug 27, 2002
In-line electrical monitor for measuring mechanical stress at the device level on a semiconductor wafer
IBM36 citations92
US5547894AAug 20, 1996
CMOS processing with low and high-current FETs
IBM20 citations92
US6445050B1Sep 3, 2002
Symmetric device with contacts self aligned to gate
IBM24 citations91
US6417515B1Jul 9, 2002
In-situ ion implant activation and measurement apparatus
IBM38 citations91
US7883990B2Feb 8, 2011
High resistivity SOI base wafer using thermally annealed substrate
IBM29 citations89
US10629710B2Apr 21, 2020
Integrated circuit heat dissipation using nanostructures
IBM3 citations84
US10109553B2Oct 23, 2018
Integrated circuit heat dissipation using nanostructures
IBM4 citations84
US10068827B2Sep 4, 2018
Integrated circuit heat dissipation using nanostructures
IBM5 citations84
US9601606B2Mar 21, 2017
Integrated circuit heat dissipation using nanostructures
IBM7 citations84
US8026131B2Sep 27, 2011
SOI radio frequency switch for reducing high frequency harmonics
IBM9 citations84
US7479688B2Jan 20, 2009
STI stress modification by nitrogen plasma treatment for improving performance in small width devices
IBM11 citations84
US6417070B1Jul 9, 2002
Method for forming a liner in a trench
IBM15 citations84
US9653477B2May 16, 2017
Single-chip field effect transistor (FET) switch with silicon germanium (SiGe) power amplifier and methods of forming
IBM6 citations83
US9646993B2May 9, 2017
Single-chip field effect transistor (FET) switch with silicon germanium (SiGe) power amplifier and methods of forming
IBM7 citations83
US6946376B2Sep 20, 2005
Symmetric device with contacts self aligned to gate
IBM15 citations82
US6967380B2Nov 22, 2005
CMOS device having retrograde n-well and p-well
IBM6 citations74
US10600893B2Mar 24, 2020
Integrated circuit heat dissipation using nanostructures
IBM2 citations73
US9704978B2Jul 11, 2017
Integrated circuit heat dissipation using nanostructures
IBM2 citations73
US9666701B2May 30, 2017
Integrated circuit heat dissipation using nanostructures
IBM2 citations73
US9530711B2Dec 27, 2016
Silicon-on-insulator heat sink
IBM4 citations73
US9059269B2Jun 16, 2015
Silicon-on-insulator heat sink
IBM4 citations73
US6946710B2Sep 20, 2005
Method and structure to reduce CMOS inter-well leakage
IBM7 citations73
US6686252B2Feb 3, 2004
Method and structure to reduce CMOS inter-well leakage
IBM9 citations73
US6649429B2Nov 18, 2003
In-line electrical monitor for measuring mechanical stress at the device level on a semiconductor wafer
IBM9 citations73
US6274465B1Aug 14, 2001
DC electric field assisted anneal
IBM5 citations73
US8951896B2Feb 10, 2015
High linearity SOI wafer for low-distortion circuit applications
IBM4 citations71
US7302376B2Nov 27, 2007
Device modeling for proximity effects
IBM7 citations69
US9214561B2Dec 15, 2015
Thin body switch transistor
IBM3 citations63
US8709903B2Apr 29, 2014
Silicon-on-insulator (SOI) structure configured for reduced harmonics and method of forming the structure
IBM1 citations63
US7442996B2Oct 28, 2008
Structure and method for enhanced triple well latchup robustness
IBM3 citations63
US6875685B1Apr 5, 2005
Method of forming gas dielectric with support structure
IBM5 citations63
US11152495B2Oct 19, 2021
Integrated circuit heat dissipation using nanostructures
IBM0 citations62
US11081572B2Aug 3, 2021
Integrated circuit heat dissipation using nanostructures
IBM0 citations62
BOTULA ALAN B
6 patentsUS8492868B2Jul 23, 2013
Method, apparatus, and design structure for silicon-on-insulator high-bandwidth circuitry with reduced charge layer
BOTULA ALAN B9 citations84
US8133774B2Mar 13, 2012
SOI radio frequency switch with enhanced electrical isolation
BOTULA ALAN B12 citations84
US8748285B2Jun 10, 2014
Noble gas implantation region in top silicon layer of semiconductor-on-insulator substrate
BOTULA ALAN B5 citations73
US8698244B2Apr 15, 2014
Silicon-on-insulator (SOI) structure configured for reduced harmonics, design structure and method
BOTULA ALAN B4 citations73
US8866226B2Oct 21, 2014
SOI radio frequency switch with enhanced electrical isolation
BOTULA ALAN B2 citations63
US8471340B2Jun 25, 2013
Silicon-on-insulator (SOI) structure configured for reduced harmonics and method of forming the structure
BOTULA ALAN B4 citations63
GRECO JOSEPH R
1 patentGLOBALFOUNDRIES INC
1 patentINTERNAT BUSINESS MACHINES MAC
1 patentABOU-KHALIL MICHEL J
1 patentShowing the top 50 of 67 patents by PatentIndex Score.