Inventor

HO CHUNG W

US45 patents

⚠️ This page may combine multiple inventors who share the name “HO CHUNG W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HO CHUNG W

THIN FILM MODULE INC

Structure of a substrate for a high density semiconductor package

Quick turn around fabrication process for packaging substrates and high density cards

High density wire bond BGA

Cavity down flip chip BGA

High density flip chip BGA

High density flip chip BGA

Low cost method of testing a cavity-up BGA substrate

Quick turn around fabrication process for packaging substrates and high density cards

Low cost high density thin film processing

HO CHUNG W

Manufacturing method of circuit substrate including electronic device

Chip carrier and manufacturing method thereof

Chip package structure and manufacturing method thereof

Process of electronic structure and electronic structure

Chip package structure and manufacturing method thereof

Method for manufacturing circuit board

Edge separation equipment and operating method thereof

IBM

Capacitive chip carrier and multilayer ceramic capacitors

Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface

Low inductance MLC capacitor with metal impregnation and solder bar contact

Multiple layer, ceramic carrier for high switching speed VLSI chips

Discretionary fly wire chip interconnection

Thin film lossy line for preventing reflections in microcircuit chip package interconnections

UNIMICRON TECHNOLOGY CORP

Coreless packaging substrate and method of fabricating the same

Method of fabricating packaging substrate

Method of fabricating substrate

Structure of substrate

Carrier and method for fabricating coreless packaging substrate

Substrate core

TSENG TZYY-JANG

Coreless package substrate and fabrication method thereof

Packaging substrate and method of fabricating the same

Coreless packaging substrate and method of fabricating the same

Packaging substrate and fabrication method thereof

MICROMODULE SYSTEMS INC

Packaging and interconnect system for integrated circuits

Bare die carrier

Packaging and interconnect system for integrated circuits

DIGITAL EQUIPMENT CORP

High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion

Method of testing semiconductor chips with reusable test package

Method of forming a multilevel interconnection device

APTOS CORP

Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball

Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball

SUBTRON TECHNOLOGY CO LTD

Printed wiring board and method of fabricating the same

High thermal conducting circuit substrate and manufacturing process thereof

KULICKE & SOFFA IND INC

Bare die carrier

Bare die carrier

UNIMICRON TECH CORPORATION

Method of fabricating packaging substrate