Inventor
OH CHANG-WOO
KR57 patents
⚠️ This page may combine multiple inventors who share the name “OH CHANG-WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
40 patentsUS7297600B2Nov 20, 2007
Methods of forming fin field effect transistors using oxidation barrier layers
SAMSUNG ELECTRONICS CO LTD135 citations99
US7332386B2Feb 19, 2008
Methods of fabricating fin field transistors
SAMSUNG ELECTRONICS CO LTD56 citations98
US7442988B2Oct 28, 2008
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD50 citations96
US9324850B2Apr 26, 2016
Integrated circuit devices and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD15 citations93
US8815702B2Aug 26, 2014
Methods of manufacturing semiconductor devices having a support structure for an active layer pattern
SAMSUNG ELECTRONICS CO LTD13 citations93
US7402493B2Jul 22, 2008
Method for forming non-volatile memory devices
SAMSUNG ELECTRONICS CO LTD35 citations93
US7396726B2Jul 8, 2008
Methods of fabricating surrounded-channel transistors with directionally etched gate or insulator formation regions
SAMSUNG ELECTRONICS CO LTD21 citations93
US7361545B2Apr 22, 2008
Field effect transistor with buried gate pattern
SAMSUNG ELECTRONICS CO LTD26 citations93
US7271456B2Sep 18, 2007
Semiconductor devices including stress inducing layers
SAMSUNG ELECTRONICS CO LTD19 citations93
US7247896B2Jul 24, 2007
Semiconductor devices having a field effect transistor and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD25 citations93
US7161206B2Jan 9, 2007
Non-volatile memory devices
SAMSUNG ELECTRONICS CO LTD33 citations93
US7122431B2Oct 17, 2006
Methods of fabrication metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions
SAMSUNG ELECTRONICS CO LTD20 citations92
US9287402B2Mar 15, 2016
Method of fabricating fin-field effect transistors (finFETs) having different fin widths
SAMSUNG ELECTRONICS CO LTD20 citations91
US8987100B2Mar 24, 2015
Method of fabricating fin-field effect transistors (finfets) having different fin widths
SAMSUNG ELECTRONICS CO LTD14 citations91
US7800172B2Sep 21, 2010
Methods of forming semiconductor devices having multiple channel MOS transistors and related intermediate structures
SAMSUNG ELECTRONICS CO LTD14 citations84
US7605025B2Oct 20, 2009
Methods of forming MOSFETS using crystalline sacrificial structures
SAMSUNG ELECTRONICS CO LTD14 citations84
US7510932B2Mar 31, 2009
Semiconductor devices having a field effect transistor and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US7316968B2Jan 8, 2008
Methods of forming semiconductor devices having multiple channel MOS transistors
SAMSUNG ELECTRONICS CO LTD9 citations84
US7265031B2Sep 4, 2007
Methods of fabricating semiconductor-on-insulator (SOI) substrates and semiconductor devices using sacrificial layers and void spaces
SAMSUNG ELECTRONICS CO LTD10 citations84
US9443935B2Sep 13, 2016
Method of fabricating fin-field effect transistors (finFETs) having different fin widths
SAMSUNG ELECTRONICS CO LTD13 citations83
US7851859B2Dec 14, 2010
Single transistor memory device having source and drain insulating regions and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD17 citations83
US7859064B1Dec 28, 2010
Semiconductor devices including channel and junction regions of different semiconductor materials
SAMSUNG ELECTRONICS CO LTD6 citations74
US7652322B2Jan 26, 2010
Split gate flash memory device having self-aligned control gate and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations74
US7601592B2Oct 13, 2009
Method for forming multi-gate non-volatile memory devices using a damascene process
SAMSUNG ELECTRONICS CO LTD6 citations74
US7419879B2Sep 2, 2008
Transistor having gate dielectric layer of partial thickness difference and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US7341912B2Mar 11, 2008
Split gate flash memory device having self-aligned control gate and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations74
US7321144B2Jan 22, 2008
Semiconductor device employing buried insulating layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US9673099B2Jun 6, 2017
Method of fabricating integrated circuit devices
SAMSUNG ELECTRONICS CO LTD4 citations73
US7535051B2May 19, 2009
Memory device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD7 citations73
USRE49988EMay 28, 2024
Integrated circuit devices
SAMSUNG ELECTRONICS CO LTD0 citations63
US7989854B2Aug 2, 2011
Semiconductor devices having a support structure for an active layer pattern
SAMSUNG ELECTRONICS CO LTD2 citations63
US7952151B2May 31, 2011
Semiconductor devices including fin shaped semiconductor regions and stress inducing layers
SAMSUNG ELECTRONICS CO LTD2 citations63
US7883969B2Feb 8, 2011
Metal oxide semiconductor field effect transistors (MOSFETs) including recessed channel regions and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7709308B2May 4, 2010
Semiconductor devices and methods of fabricating the same including forming a fin with first and second gates on the sidewalls
SAMSUNG ELECTRONICS CO LTD3 citations63
US7618864B2Nov 17, 2009
Nonvolatile memory device and methods of forming the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7575964B2Aug 18, 2009
Semiconductor device employing buried insulating layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD4 citations63
US7541645B2Jun 2, 2009
Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions
SAMSUNG ELECTRONICS CO LTD4 citations63
US7361956B2Apr 22, 2008
Semiconductor device having partially insulated field effect transistor (PiFET) and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US6951785B2Oct 4, 2005
Methods of forming field effect transistors including raised source/drain regions
SAMSUNG ELECTRONICS CO LTD6 citations63
US7816228B2Oct 19, 2010
Method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations62
OH CHANG-WOO
8 patentsUS8101475B2Jan 24, 2012
Field effect transistor and method for manufacturing the same
OH CHANG-WOO48 citations97
US7745871B2Jun 29, 2010
Fin field effect transistors including oxidation barrier layers
OH CHANG-WOO46 citations96
US8466511B2Jun 18, 2013
Vertical channel fin field-effect transistors having increased source/drain contact area and methods for fabricating the same
OH CHANG-WOO31 citations92
US8178924B2May 15, 2012
Semiconductor device having floating body element and bulk body element
OH CHANG-WOO7 citations84
US9490177B2Nov 8, 2016
Integrated circuit devices including stress proximity effects and methods of fabricating the same
OH CHANG-WOO14 citations83
US8461653B2Jun 11, 2013
Semiconductor devices including fin shaped semiconductor regions and stress inducing layers
OH CHANG-WOO1 citations63
US8426901B2Apr 23, 2013
Semiconductor devices having a support structure for an active layer pattern
OH CHANG-WOO2 citations63
US8415210B2Apr 9, 2013
Field effect transistor and method for manufacturing the same
OH CHANG-WOO3 citations62
AMOSENSE CO LTD
2 patentsShowing the top 50 of 57 patents by PatentIndex Score.