P

Inventor

OH CHANG-WOO

KR57 patents
⚠️ This page may combine multiple inventors who share the name “OH CHANG-WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

40 patents
US7297600B2Nov 20, 2007

Methods of forming fin field effect transistors using oxidation barrier layers

SAMSUNG ELECTRONICS CO LTD135 citations99
US7332386B2Feb 19, 2008

Methods of fabricating fin field transistors

SAMSUNG ELECTRONICS CO LTD56 citations98
US7442988B2Oct 28, 2008

Semiconductor devices and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD50 citations96
US9324850B2Apr 26, 2016

Integrated circuit devices and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD15 citations93
US8815702B2Aug 26, 2014

Methods of manufacturing semiconductor devices having a support structure for an active layer pattern

SAMSUNG ELECTRONICS CO LTD13 citations93
US7402493B2Jul 22, 2008

Method for forming non-volatile memory devices

SAMSUNG ELECTRONICS CO LTD35 citations93
US7396726B2Jul 8, 2008

Methods of fabricating surrounded-channel transistors with directionally etched gate or insulator formation regions

SAMSUNG ELECTRONICS CO LTD21 citations93
US7361545B2Apr 22, 2008

Field effect transistor with buried gate pattern

SAMSUNG ELECTRONICS CO LTD26 citations93
US7271456B2Sep 18, 2007

Semiconductor devices including stress inducing layers

SAMSUNG ELECTRONICS CO LTD19 citations93
US7247896B2Jul 24, 2007

Semiconductor devices having a field effect transistor and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD25 citations93
US7161206B2Jan 9, 2007

Non-volatile memory devices

SAMSUNG ELECTRONICS CO LTD33 citations93
US7122431B2Oct 17, 2006

Methods of fabrication metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions

SAMSUNG ELECTRONICS CO LTD20 citations92
US9287402B2Mar 15, 2016

Method of fabricating fin-field effect transistors (finFETs) having different fin widths

SAMSUNG ELECTRONICS CO LTD20 citations91
US8987100B2Mar 24, 2015

Method of fabricating fin-field effect transistors (finfets) having different fin widths

SAMSUNG ELECTRONICS CO LTD14 citations91
US7800172B2Sep 21, 2010

Methods of forming semiconductor devices having multiple channel MOS transistors and related intermediate structures

SAMSUNG ELECTRONICS CO LTD14 citations84
US7605025B2Oct 20, 2009

Methods of forming MOSFETS using crystalline sacrificial structures

SAMSUNG ELECTRONICS CO LTD14 citations84
US7510932B2Mar 31, 2009

Semiconductor devices having a field effect transistor and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations84
US7316968B2Jan 8, 2008

Methods of forming semiconductor devices having multiple channel MOS transistors

SAMSUNG ELECTRONICS CO LTD9 citations84
US7265031B2Sep 4, 2007

Methods of fabricating semiconductor-on-insulator (SOI) substrates and semiconductor devices using sacrificial layers and void spaces

SAMSUNG ELECTRONICS CO LTD10 citations84
US9443935B2Sep 13, 2016

Method of fabricating fin-field effect transistors (finFETs) having different fin widths

SAMSUNG ELECTRONICS CO LTD13 citations83
US7851859B2Dec 14, 2010

Single transistor memory device having source and drain insulating regions and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD17 citations83
US7859064B1Dec 28, 2010

Semiconductor devices including channel and junction regions of different semiconductor materials

SAMSUNG ELECTRONICS CO LTD6 citations74
US7652322B2Jan 26, 2010

Split gate flash memory device having self-aligned control gate and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD5 citations74
US7601592B2Oct 13, 2009

Method for forming multi-gate non-volatile memory devices using a damascene process

SAMSUNG ELECTRONICS CO LTD6 citations74
US7419879B2Sep 2, 2008

Transistor having gate dielectric layer of partial thickness difference and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US7341912B2Mar 11, 2008

Split gate flash memory device having self-aligned control gate and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD8 citations74
US7321144B2Jan 22, 2008

Semiconductor device employing buried insulating layer and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US9673099B2Jun 6, 2017

Method of fabricating integrated circuit devices

SAMSUNG ELECTRONICS CO LTD4 citations73
US7535051B2May 19, 2009

Memory device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD7 citations73
USRE49988EMay 28, 2024

Integrated circuit devices

SAMSUNG ELECTRONICS CO LTD0 citations63
US7989854B2Aug 2, 2011

Semiconductor devices having a support structure for an active layer pattern

SAMSUNG ELECTRONICS CO LTD2 citations63
US7952151B2May 31, 2011

Semiconductor devices including fin shaped semiconductor regions and stress inducing layers

SAMSUNG ELECTRONICS CO LTD2 citations63
US7883969B2Feb 8, 2011

Metal oxide semiconductor field effect transistors (MOSFETs) including recessed channel regions and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations63
US7709308B2May 4, 2010

Semiconductor devices and methods of fabricating the same including forming a fin with first and second gates on the sidewalls

SAMSUNG ELECTRONICS CO LTD3 citations63
US7618864B2Nov 17, 2009

Nonvolatile memory device and methods of forming the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7575964B2Aug 18, 2009

Semiconductor device employing buried insulating layer and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD4 citations63
US7541645B2Jun 2, 2009

Metal oxide semiconductor (MOS) transistors having buffer regions below source and drain regions

SAMSUNG ELECTRONICS CO LTD4 citations63
US7361956B2Apr 22, 2008

Semiconductor device having partially insulated field effect transistor (PiFET) and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations63
US6951785B2Oct 4, 2005

Methods of forming field effect transistors including raised source/drain regions

SAMSUNG ELECTRONICS CO LTD6 citations63
US7816228B2Oct 19, 2010

Method of manufacturing a semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations62

OH CHANG-WOO

8 patents

AMOSENSE CO LTD

2 patents

Showing the top 50 of 57 patents by PatentIndex Score.