Inventor

FU QIAN

US63 patents

⚠️ This page may combine multiple inventors who share the name “FU QIAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FU QIAN

LAM RES CORP

Systems and methods for reverse pulsing

Systems and methods for reverse pulsing

Atomic layer etching in continuous plasma

Spacer profile control using atomic layer deposition in a multiple patterning process

Methods and systems for advanced ion control for etching processes

Method for reducing microloading in etching high aspect ratio structures

Method for forming stair-step structures

Hybrid stair-step etch

Methods and systems for advanced ion control for etching processes

Silicon-based deposition for semiconductor processing

Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamber

Post etch treatment to prevent pattern collapse

Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabrication

Method for forming stair-step structures

Line width roughness improvement with noble gas plasma

Line width roughness improvement with noble gas plasma

Method and apparatus for anisotropic tungsten etching

Method and apparatus for anisotropic tungsten etching

Continuous plasma ETCH process

Systems and methods for reverse pulsing

Methods and systems for advanced ion control for etching processes

Systems for reverse pulsing

Methods and systems for advanced ion control for etching processes

Extending storage time of removed plasma chamber components prior to cleaning thereof

Phase change alloy etch

Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level

Line edge roughness improvement with photon-assisted plasma process

Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power level

Etch process with pre-etch transient conditioning

Continuous plasma etch process

Method to etch a tungsten containing layer

Etch process with pre-etch transient conditioning

Etch process with pre-etch transient conditioning

APPLIED MATERIALS INC

Sidewall passivation for plasma etching

Dry etching with etch byproduct self-cleaning

Selection gate separation for 3D NAND

Pulsed etch process

Boron nitride for mask patterning

Carbon hardmask opening using boron nitride mask

Enhanced etch selectivity using halides

Selective carbon deposition on top and bottom surfaces of semiconductor substrates

Method for etching high aspect ratio structures

LEE WONCHUL

Pulsed bias plasma process to control microloading

Method of controlling etch microloading for a tungsten-containing layer

FU QIAN

Method for forming stair-step structures

Method for forming stair-step structures

CHENG SHIH-YUAN

Line width roughness improvement with noble gas plasma

KAMP TOM

Plasma etch method to reduce micro-loading

MIKHAYLICHENKO KATRINA

Method and apparatus for pattern collapse free wet processing of semiconductor devices

BAE IN DEOG

Selective etch of high-k dielectric material