Inventor
MISUMI SADAHITO
JP31 patents
⚠️ This page may combine multiple inventors who share the name “MISUMI SADAHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
20 patentsUS7863182B2Jan 4, 2011
Dicing die-bonding film
NITTO DENKO CORP23 citations92
USD589473SMar 31, 2009
Adhesive film material for use in manufacturing semiconductors
NITTO DENKO CORP23 citations92
US7508081B2Mar 24, 2009
Dicing die-bonding film
NITTO DENKO CORP30 citations92
US7449226B2Nov 11, 2008
Dicing die-bonding film, method of fixing chipped work and semiconductor device
NITTO DENKO CORP20 citations92
USD549189SAug 21, 2007
Dicing die-bonding film
NITTO DENKO CORP29 citations92
US6896994B2May 24, 2005
Battery separator containing carbodiimide polymer
NITTO DENKO CORP19 citations92
US6652688B2Nov 25, 2003
Process for producing semiconductor wafer with adhesive film
NITTO DENKO CORP21 citations92
US6492484B2Dec 10, 2002
Polycarbodiimide
NITTO DENKO CORP25 citations92
US6228972B1May 8, 2001
Aromatic polycarbodiimide and water repellent sheet made therefrom
NITTO DENKO CORP23 citations92
US6669869B2Dec 30, 2003
Anisotropic conductive film
NITTO DENKO CORP17 citations84
US7232709B2Jun 19, 2007
Process for producing a semiconductor device
NITTO DENKO CORP14 citations83
US6248857B1Jun 19, 2001
Aromatic polycarbodiimide and polycarbodiimide sheet
NITTO DENKO CORP16 citations83
US7772040B2Aug 10, 2010
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
NITTO DENKO CORP6 citations74
US7611926B2Nov 3, 2009
Thermosetting die bonding film
NITTO DENKO CORP6 citations71
US7780811B2Aug 24, 2010
Dicing die-bonding film, method of fixing chipped work and semiconductor device
NITTO DENKO CORP4 citations63
US6811927B1Nov 2, 2004
Battery containing a polycarbodiimide polymer
NITTO DENKO CORP5 citations62
US6414105B2Jul 2, 2002
Aromatic polycarbodiimide and sheet thereof
NITTO DENKO CORP4 citations62
US6410615B1Jun 25, 2002
Semiconductor sealing epoxy resin composition and semiconductor device using the same
NITTO DENKO CORP5 citations61
US7998552B2Aug 16, 2011
Dicing/die bonding film
NITTO DENKO CORP1 citations51
US9105754B2Aug 11, 2015
Adhesive film, method of manufacturing semiconductor device, and semiconductor device
NITTO DENKO CORP1 citations50
MISUMI SADAHITO
4 patentsUS8703584B2Apr 22, 2014
Dicing tape-integrated film for semiconductor back surface
MISUMI SADAHITO4 citations72
US8278153B2Oct 2, 2012
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
MISUMI SADAHITO4 citations61
US8236614B2Aug 7, 2012
Semiconductor device manufacturing method
MISUMI SADAHITO5 citations61
US8975759B2Mar 10, 2015
Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
MISUMI SADAHITO0 citations51
MATSUMURA TAKESHI
2 patentsSUGO YUKI
2 patentsITO HISATAKA
2 patentsUS8890190B2Nov 18, 2014
Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection component
ITO HISATAKA0 citations49
US8642362B2Feb 4, 2014
Method for producing light-emitting diode device
ITO HISATAKA0 citations49