Inventor
CHUANG JUI-YU
TW10 patents
Patents
10 patentsUS6483178B1Nov 19, 2002
Semiconductor device package structure
SILICONWARE PRECISION INDUSTRIES CO LTD135 citations97
US6472743B2Oct 29, 2002
Semiconductor package with heat dissipating structure
SILICONWARE PRECISION INDUSTRIES CO LTD74 citations94
USD529031SSep 26, 2006
IC card type circuit module
SILICONWARE PRECISION INDUSTRIES CO LTD41 citations92
US6847104B2Jan 25, 2005
Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD42 citations92
US6781222B2Aug 24, 2004
Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD34 citations92
USD492314SJun 29, 2004
IC card type circuit module
SILICONWARE PRECISION INDUSTRIES CO LTD24 citations92
US6673690B2Jan 6, 2004
Method of mounting a passive component over an integrated circuit package substrate
SILICONWARE PRECISION INDUSTRIES CO LTD32 citations92
US7339280B2Mar 4, 2008
Semiconductor package with lead frame as chip carrier and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD10 citations83
US6538321B2Mar 25, 2003
Heat sink with collapse structure and semiconductor package with heat sink
SILICONWARE PRECISION INDUSTRIES CO LTD14 citations83
US6858931B2Feb 22, 2005
Heat sink with collapse structure for semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations73