Inventor
CHAN LIEN-CHI
TW7 patents
Patents
7 patentsUSD529031SSep 26, 2006
IC card type circuit module
SILICONWARE PRECISION INDUSTRIES CO LTD41 citations92
US6847104B2Jan 25, 2005
Window-type ball grid array semiconductor package with lead frame as chip carrier and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD42 citations92
USD492314SJun 29, 2004
IC card type circuit module
SILICONWARE PRECISION INDUSTRIES CO LTD24 citations92
US6359342B1Mar 19, 2002
Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD37 citations86
US7339280B2Mar 4, 2008
Semiconductor package with lead frame as chip carrier and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD10 citations83
US6538321B2Mar 25, 2003
Heat sink with collapse structure and semiconductor package with heat sink
SILICONWARE PRECISION INDUSTRIES CO LTD14 citations83
US6858931B2Feb 22, 2005
Heat sink with collapse structure for semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations73