Inventor
MIN YONGKI
US28 patents
⚠️ This page may combine multiple inventors who share the name “MIN YONGKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
24 patentsUS7290315B2Nov 6, 2007
Method for making a passive device structure
INTEL CORP18 citations92
US7402909B2Jul 22, 2008
Microelectronic package interconnect and method of fabrication thereof
INTEL CORP12 citations84
US7572709B2Aug 11, 2009
Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
INTEL CORP9 citations83
US7553738B2Jun 30, 2009
Method of fabricating a microelectronic device including embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method
INTEL CORP9 citations83
US7435675B2Oct 14, 2008
Method of providing a pre-patterned high-k dielectric film
INTEL CORP14 citations83
US7710709B2May 4, 2010
Carbon nanotube coated capacitor electrodes
INTEL CORP7 citations74
US7727814B2Jun 1, 2010
Microelectronic package interconnect and method of fabrication thereof
INTEL CORP5 citations73
US11581271B2Feb 14, 2023
Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate
INTEL CORP2 citations72
US10340260B2Jul 2, 2019
Magnetic small footprint inductor array module for on-package voltage regulator
INTEL CORP1 citations69
US9911723B2Mar 6, 2018
Magnetic small footprint inductor array module for on-package voltage regulator
INTEL CORP3 citations69
US8003479B2Aug 23, 2011
Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
INTEL CORP2 citations63
US7705458B2Apr 27, 2010
Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
INTEL CORP3 citations63
US7738257B2Jun 15, 2010
Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making same
INTEL CORP2 citations62
US7733626B2Jun 8, 2010
Passive device structure
INTEL CORP3 citations62
US7687366B2Mar 30, 2010
Pre-patterned thin film capacitor and method for embedding same in a package substrate
INTEL CORP5 citations62
US7588992B2Sep 15, 2009
Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing same
INTEL CORP6 citations62
US7525140B2Apr 28, 2009
Integrated thin film capacitors with adhesion holes for the improvement of adhesion strength
INTEL CORP4 citations62
US7416938B2Aug 26, 2008
Inkjet patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
INTEL CORP4 citations62
US11335616B2May 17, 2022
Substrate integrated inductor with composite magnetic resin layer
INTEL CORP0 citations60
US10157860B2Dec 18, 2018
Component stiffener architectures for microelectronic package structures
INTEL CORP1 citations51
US7981758B2Jul 19, 2011
Systems and methods to laminate passives onto substrate
INTEL CORP0 citations51
US7838419B2Nov 23, 2010
Systems and methods to laminate passives onto substrate
INTEL CORP0 citations51
US10741536B2Aug 11, 2020
Magnetic small footprint inductor array module for on-package voltage regulator
INTEL CORP0 citations48
US7983020B2Jul 19, 2011
Carbon nanotube coated capacitor electrodes
INTEL CORP1 citations42
SEH HUANKIAT
2 patentsUS8143697B2Mar 27, 2012
Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
SEH HUANKIAT5 citations69
US8623737B2Jan 7, 2014
Sol-gel and mask patterning for thin-film capacitor fabrication, thin-film capacitors fabricated thereby, and systems containing same
SEH HUANKIAT0 citations48