Inventor
TOMORI NAOKI
JP16 patents
⚠️ This page may combine multiple inventors who share the name “TOMORI NAOKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHOWA DENKO MATERIALS CO LTD
7 patentsUSD999179SSep 19, 2023
Temporary protective film for manufacturing semiconductor devices
SHOWA DENKO MATERIALS CO LTD1 citations71
USD962883SSep 6, 2022
Temporary protective film for manufacturing semiconductor devices
SHOWA DENKO MATERIALS CO LTD2 citations71
USD962882SSep 6, 2022
Temporary protective film for manufacturing semiconductor devices
SHOWA DENKO MATERIALS CO LTD2 citations71
USD946540SMar 22, 2022
Temporary protective film for manufacturing semiconductor devices
SHOWA DENKO MATERIALS CO LTD2 citations71
US12227379B2Feb 18, 2025
Adhesive film production apparatus and reel bodies
SHOWA DENKO MATERIALS CO LTD0 citations60
USD998577SSep 12, 2023
Temporary protective film for manufacturing semiconductor devices
SHOWA DENKO MATERIALS CO LTD0 citations60
US11682564B2Jun 20, 2023
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device
SHOWA DENKO MATERIALS CO LTD0 citations60
RESONAC CORP
4 patentsUS12435248B2Oct 7, 2025
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor package
RESONAC CORP0 citations50
US12398298B2Aug 26, 2025
Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device
RESONAC CORP0 citations50
US12134534B2Nov 5, 2024
Adhesive film production apparatus and adhesive film production method
RESONAC CORP0 citations50
US12060239B2Aug 13, 2024
Reel body, method for manufacturing reel body, and method for manufacturing article
RESONAC CORP0 citations50
HITACHI CHEMICAL CO LTD
3 patentsUS11908762B2Feb 20, 2024
Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor device
HITACHI CHEMICAL CO LTD0 citations60
US11251055B2Feb 15, 2022
Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device
HITACHI CHEMICAL CO LTD1 citations60
US11195728B2Dec 7, 2021
Temporary protective film for semiconductor sealing molding
HITACHI CHEMICAL CO LTD0 citations59