Inventor

DELIGIANNI HARIKLIA

US171 patents

⚠️ This page may combine multiple inventors who share the name “DELIGIANNI HARIKLIA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DELIGIANNI HARIKLIA

IBM

Methods of manufacture of vertical nanowire FET devices

Selective capping of copper wiring

Flip-Chip interconnections using lead-free solders

Copper alloys for chip and package interconnections

Method of making electroplated interconnection structures on integrated circuit chips

Field effect transistor with electroplated metal gate

Method and apparatus for enhancing the uniformity of electrodeposition or electroetching

Method of making copper alloys for chip and package interconnections

MEMS RF switch with low actuation voltage

3D integrated DC-DC power converters

High resistivity soft magnetic material for miniaturized power converter

Formation of nanostructures comprising compositionally modulated ferromagnetic layers by pulsed ECD

Structure and method of forming electrodeposited contacts

Selective capping of copper wiring

Lateral microelectromechanical system switch

Method for electroplating on resistive substrates

Lateral microelectromechanical system switch

Micro-electro-mechanical RF switch

Method for enhancing the uniformity of electrodeposition or electroetching

Electroplating apparatus and method using a compressible contact

Noble metal contacts for micro-electromechanical switches

Field effect transistor with electroplated metal gate

Deep filled vias

Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density

Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition

Method for fabricating a magnetic material stack

Bias of physical controllers in a system

Magnetic inductor stacks with multilayer isolation layers

On-chip DC-DC power converters with fully integrated GaN power switches, silicon CMOS transistors and magnetic inductors

High resistivity iron-based, thermally stable magnetic material for on-chip integrated inductors

High resistivity iron-based, thermally stable magnetic material for on-chip integrated inductors

Forming an electrode having reduced corrosion and water decomposition on surface using an organic protective layer

Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow

Complementary metal oxide semiconductor device with an electroplated metal replacement gate

Method of fabricating a high Q factor integrated circuit inductor

Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow

High Q factor integrated circuit inductor

Micro-electromechanical switch having a conductive compressible electrode

Electroplated CoWP composite structures as copper barrier layers

Electroplated CoWP composite structures as copper barrier layers

Self-constrained anisotropic germanium nanostructure from electroplating

Formation of vertical devices by electroplating

Porous nanostructured electrodes for detection of neurotransmitters

DELIGIANNI HARIKLIA

Vertical nanowire FET devices

Battery with self-programming fuse

Electrodeposition of thin-film cells containing non-toxic elements

CABRAL JR CYRIL

Contact metallurgy structure

BASKER VEERARAGHAVAN S

Apparatus and method for electrochemical processing of thin films on resistive substrates

AHMED SHAFAAT

Structure and method of fabricating a CZTS photovoltaic device by electrodeposition

EBARA CORP

Plating apparatus and plating method