P

Inventor

KIM SUNG-BONG

KR34 patents
⚠️ This page may combine multiple inventors who share the name “KIM SUNG-BONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

28 patents
US6806180B2Oct 19, 2004

Unitary interconnection structures integral with a dielectric layer

SAMSUNG ELECTRONICS CO LTD52 citations96
US5495244AFeb 27, 1996

Device for encoding and decoding transmission signals through adaptive selection of transforming methods

SAMSUNG ELECTRONICS CO LTD92 citations96
US9324850B2Apr 26, 2016

Integrated circuit devices and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD15 citations93
US6335279B2Jan 1, 2002

Method of forming contact holes of semiconductor device

SAMSUNG ELECTRONICS CO LTD53 citations93
US7312144B2Dec 25, 2007

Unitary interconnection structures integral with a dielectric layer and fabrication methods thereof

SAMSUNG ELECTRONICS CO LTD24 citations92
US7183662B2Feb 27, 2007

Memory devices with memory cell transistors having gate sidewell spacers with different dielectric properties

SAMSUNG ELECTRONICS CO LTD18 citations92
US6828210B2Dec 7, 2004

Method of forming a device isolation trench in an integrated circuit device

SAMSUNG ELECTRONICS CO LTD21 citations92
US6313510B1Nov 6, 2001

Integrated circuits including metal silicide contacts extending between a gate electrode and a source/drain region

SAMSUNG ELECTRONICS CO LTD23 citations92
US6147385ANov 14, 2000

CMOS static random access memory devices

SAMSUNG ELECTRONICS CO LTD27 citations92
US5851868ADec 22, 1998

Methods of forming integrated decoupling capacitors

SAMSUNG ELECTRONICS CO LTD27 citations92
US6680538B2Jan 20, 2004

Semiconductor device for suppressing detachment of conductive layer

SAMSUNG ELECTRONICS CO LTD35 citations90
US6448651B1Sep 10, 2002

Semiconductor device having a multi-level metallization and its fabricating method

SAMSUNG ELECTRONICS CO LTD17 citations84
US6767814B2Jul 27, 2004

Semiconductor device having silicide thin film and method of forming the same

SAMSUNG ELECTRONICS CO LTD14 citations82
US6169020B1Jan 2, 2001

Methods of fabricating integrated circuits including metal silicide contacts extending between a gate electrode and a source/drain region

SAMSUNG ELECTRONICS CO LTD6 citations74
US9673099B2Jun 6, 2017

Method of fabricating integrated circuit devices

SAMSUNG ELECTRONICS CO LTD4 citations73
US6870231B2Mar 22, 2005

Layouts for CMOS SRAM cells and devices

SAMSUNG ELECTRONICS CO LTD11 citations73
US6645849B2Nov 11, 2003

Method for manufacturing semiconductor device for suppressing detachment of conductive layer

SAMSUNG ELECTRONICS CO LTD8 citations71
USRE49988EMay 28, 2024

Integrated circuit devices

SAMSUNG ELECTRONICS CO LTD0 citations63
US7141851B2Nov 28, 2006

Transistors having a recessed channel region

SAMSUNG ELECTRONICS CO LTD3 citations63
US6265284B1Jul 24, 2001

Method of manufacturing a trench isolation region in a semiconductor device

SAMSUNG ELECTRONICS CO LTD6 citations63
US6165900ADec 26, 2000

Method for manufacturing semiconductor device

SAMSUNG ELECTRONICS CO LTD4 citations63
US6133141AOct 17, 2000

Methods of forming electrical connections between conductive layers

SAMSUNG ELECTRONICS CO LTD6 citations63
US6653238B2Nov 25, 2003

Method for forming semiconductor device having high-density contacts

SAMSUNG ELECTRONICS CO LTD6 citations62
US7405450B2Jul 29, 2008

Semiconductor devices having high conductivity gate electrodes with conductive line patterns thereon

SAMSUNG ELECTRONICS CO LTD3 citations61
US7385260B2Jun 10, 2008

Semiconductor device having silicide thin film and method of forming the same

SAMSUNG ELECTRONICS CO LTD4 citations60
US7560353B2Jul 14, 2009

Methods of fabricating memory devices with memory cell transistors having gate sidewall spacers with different dielectric properties

SAMSUNG ELECTRONICS CO LTD0 citations52
US6288926B1Sep 11, 2001

Static semiconductor memory device and fabricating method thereof

SAMSUNG ELECTRONICS CO LTD0 citations52
US10109518B1Oct 23, 2018

Pickup unit and pickup system of semiconductor device including the same

SAMSUNG ELECTRONICS CO LTD0 citations36

KIM SUNG BONG

2 patents

LG ELECTRONICS INC

1 patent

MAEDA SHIGENOBU

1 patent

DONGBU HITEK CO LTD

1 patent

LEE IN-WOO

1 patent