Inventor

MATSUZAWA TOMOO

JP8 patents

⚠️ This page may combine multiple inventors who share the name “MATSUZAWA TOMOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RENESAS TECH CORP

4 patents

US6897570B2May 24, 2005

Semiconductor device and method of manufacturing same

RENESAS TECH CORP54 citations95

US7449786B2Nov 11, 2008

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

RENESAS TECH CORP6 citations73

US7049214B2May 23, 2006

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

RENESAS TECH CORP8 citations73

US7015127B2Mar 21, 2006

Semiconductor device and a method of manufacturing the same

RENESAS TECH CORP0 citations51

HITACHI ULSI SYS CO LTD

1 patent

US6900551B2May 31, 2005

Semiconductor device with alternate bonding wire arrangement

HITACHI ULSI SYS CO LTD28 citations92

HITACHI LTD

1 patent

US5252854AOct 12, 1993

Semiconductor device having stacked lead structure

HITACHI LTD51 citations92

RENESAS E JP SEMICONDUCTOR INC

1 patent

US7005310B2Feb 28, 2006

Manufacturing method of solid-state image sensing device

RENESAS E JP SEMICONDUCTOR INC51 citations91

HITACHI HOKKAI SEMICONDUCTOR

1 patent

US7199469B2Apr 3, 2007

Semiconductor device having stacked semiconductor chips sealed with a resin seal member

HITACHI HOKKAI SEMICONDUCTOR12 citations81