Inventor
ZHAO LILY
US14 patents
⚠️ This page may combine multiple inventors who share the name “ZHAO LILY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
8 patentsUS8847391B2Sep 30, 2014
Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or cracking
QUALCOMM INC4 citations66
US12113038B2Oct 8, 2024
Thermal compression flip chip bump for high performance and fine pitch
QUALCOMM INC0 citations61
US11948909B2Apr 2, 2024
Package comprising spacers between integrated devices
QUALCOMM INC1 citations61
US11694982B2Jul 4, 2023
Sidewall wetting barrier for conductive pillars
QUALCOMM INC0 citations61
US11557557B2Jan 17, 2023
Flip-chip flexible under bump metallization size
QUALCOMM INC1 citations61
US12525574B2Jan 13, 2026
Three-dimensional (3D) integrated circuit (IC) (3DIC) package with a bottom die layer employing an extended interposer substrate, and related fabrication methods
QUALCOMM INC0 citations51
US12500188B2Dec 16, 2025
Flip-chip bumping metal layer and bump structure
QUALCOMM INC0 citations51
US12469811B2Nov 11, 2025
Package comprising wire bonds coupled to integrated devices
QUALCOMM INC0 citations51
TAIWAN SEMICONDUCTOR MFG
2 patentsHONEYWELL INT INC
2 patentsUS12345936B2Jul 1, 2025
Building control device with a light guide configured for uniformly illuminating a graphical symbol that is visible to a user of the building control device
HONEYWELL INT INC0 citations44
US12282187B2Apr 22, 2025
Building control device with a light guide configured for uniformly illuminating a graphical symbol that is visible to a user of the building control device
HONEYWELL INT INC0 citations43