Inventor
LIANG DEXIN
US17 patents
⚠️ This page may combine multiple inventors who share the name “LIANG DEXIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
OLIN CORP
5 patentsUS5688606ANov 18, 1997
Anodized aluminum substrate having increased breakdown voltage
OLIN CORP64 citations94
US5360942ANov 1, 1994
Multi-chip electronic package module utilizing an adhesive sheet
OLIN CORP41 citations92
US5534356AJul 9, 1996
Anodized aluminum substrate having increased breakdown voltage
OLIN CORP38 citations91
US5455386AOct 3, 1995
Chamfered electronic package component
OLIN CORP50 citations91
US5239131AAug 24, 1993
Electronic package having controlled epoxy flow
OLIN CORP27 citations88
LSI LOGIC CORP
2 patentsUS5639696AJun 17, 1997
Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array
LSI LOGIC CORP85 citations96
US5972734AOct 26, 1999
Interposer for ball grid array (BGA) package
LSI LOGIC CORP109 citations95