Inventor
NA HOONJOO
KR44 patents
⚠️ This page may combine multiple inventors who share the name “NA HOONJOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
40 patentsUS11721628B2Aug 8, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD10 citations85
US10461167B2Oct 29, 2019
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD18 citations84
US10475898B2Nov 12, 2019
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD8 citations83
US11749587B2Sep 5, 2023
Semiconductor device
SAMSUNG ELECTRONICS CO LTD3 citations73
US11380607B2Jul 5, 2022
Semiconductor device
SAMSUNG ELECTRONICS CO LTD4 citations73
US11121131B2Sep 14, 2021
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations72
US10892342B2Jan 12, 2021
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD2 citations72
US10615264B2Apr 7, 2020
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD2 citations72
US9991357B2Jun 5, 2018
Semiconductor devices with gate electrodes on separate sets of high-k dielectric layers
SAMSUNG ELECTRONICS CO LTD4 citations72
US11749586B2Sep 5, 2023
Semiconductor device including through via structure
SAMSUNG ELECTRONICS CO LTD3 citations71
US11152317B2Oct 19, 2021
Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11362067B2Jun 14, 2022
Methods of manufacturing semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations70
US9786759B2Oct 10, 2017
Semiconductor device having multiwork function gate patterns
SAMSUNG ELECTRONICS CO LTD3 citations68
US12525539B2Jan 13, 2026
Semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations63
US12334477B2Jun 17, 2025
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US11887966B2Jan 30, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US12167596B2Dec 10, 2024
Three-dimensional semiconductor devices and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12142588B2Nov 12, 2024
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12136602B2Nov 5, 2024
Method of fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations61
US12021080B2Jun 25, 2024
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11824035B2Nov 21, 2023
Method of manufacturing a semiconductor device including bonding layer and adsorption layer
SAMSUNG ELECTRONICS CO LTD0 citations61
US11742351B2Aug 29, 2023
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11616036B2Mar 28, 2023
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11594443B2Feb 28, 2023
Substrate bonding apparatus and method of manufacturing semiconductor device by using the substrate bonding apparatus
SAMSUNG ELECTRONICS CO LTD1 citations61
US11552096B2Jan 10, 2023
Three-dimensional semiconductor devices and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11348892B2May 31, 2022
Semiconductor devices including bonding layer and adsorption layer
SAMSUNG ELECTRONICS CO LTD1 citations61
US11296045B2Apr 5, 2022
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US10950470B2Mar 16, 2021
Substrate bonding apparatus and bonding method using the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12046538B2Jul 23, 2024
Semiconductor device including through via structure
SAMSUNG ELECTRONICS CO LTD0 citations60
USRE49538EMay 30, 2023
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US8044469B2Oct 25, 2011
Semiconductor device and associated methods
SAMSUNG ELECTRONICS CO LTD2 citations60
US12300671B2May 13, 2025
Semiconductor packages and methods of manufacturing the semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations59
US11810900B2Nov 7, 2023
Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations59
US12317572B2May 27, 2025
Semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations53
US8766366B2Jul 1, 2014
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US11887841B2Jan 30, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations49
US11658139B2May 23, 2023
Semiconductor package for improving bonding reliability
SAMSUNG ELECTRONICS CO LTD0 citations49
US11728197B2Aug 15, 2023
Wafer to wafer bonding apparatus and wafer to wafer bonding method
SAMSUNG ELECTRONICS CO LTD0 citations47
US12347768B2Jul 1, 2025
Semiconductor device including via structure
SAMSUNG ELECTRONICS CO LTD0 citations44
US12166000B2Dec 10, 2024
Semiconductor device including a lower chip including a peripheral circuit and first and second memory chips vertically stacked thereon and data storage system including the same
SAMSUNG ELECTRONICS CO LTD0 citations43