Inventor

LU WEN-HSIUNG

TW117 patents

⚠️ This page may combine multiple inventors who share the name “LU WEN-HSIUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LU WEN-HSIUNG

TAIWAN SEMICONDUCTOR MFG CO LTD

Process for forming package-on-package structures

Methods of packaging and dicing semiconductor devices and structures thereof

Interconnect structure and method of fabricating same

Heterogeneous bonding structure and method forming same

Semiconductor structure and method for forming the same

Integrated circuit packages and methods for forming the same

Interconnect structures and methods of forming same

Package assembly

Packaging devices and methods of manufacture thereof

Integrated circuit packages and methods for forming the same

Interconnect joint protective layer apparatus and method

Integrated circuit packages and methods for forming the same

Interconnect structures and methods of forming same

Pillar bumps and process for making same

Semiconductor device and method for forming the same

Micro-connection structure and manufacturing method thereof

Semiconductor device and method

Semiconductor device and method

TAIWAN SEMICONDUCTOR MFG

System and method for an improved fine pitch joint

Interconnect structures and methods of forming same

Directly sawing wafers covered with liquid molding compound

Methods and apparatus for wafer level packaging

Packaging devices and methods of manufacture thereof

Process for forming package-on-package structures

Cu pillar bump with electrolytic metal sidewall protection

Methods and apparatus for wafer level packaging

Method of manufacturing a semiconductor device

Package-on-package structure and method of forming same

Ball amount process in the manufacturing of integrated circuit

Packaging methods and structures for semiconductor devices

LU WEN-HSIUNG

Cu pillar bump with electrolytic metal sidewall protection

Forming wafer-level chip scale package structures with reduced number of seed layers

Conductive pillar for semiconductor substrate and method of manufacture

Package on package interconnect structure

Semiconductor package having protective layer with curved surface and method of manufacturing same

Mechanisms for forming copper pillar bumps using patterned anodes

Mechanisms for forming copper pillar bumps using patterned anodes

LIN CHIH-WEI

Packaging methods and structures for semiconductor devices

Process for forming package-on-package structures

Method for fabricating bump structure without UBM undercut

CHEN MENG-TSE

Semiconductor packages having polymer-containing substrates and methods of forming same

Process for forming packages

Apparatus and methods for molded underfills in flip chip packaging

TU CHIA-WEI

Integrated circuit packages and methods for forming the same

CHENG MING-DA

Mechanisms for forming copper pillar bumps

LIN CHENG-CHUNG

Pillar bumps and process for making same

LIN HUNG-JEN

Package assembly and method of forming the same

LIM ZHENG-YI

Method of forming metal pillar

HUANG CHANG-CHIA

Packaging device and method of making the same

CHEN HSIEN-WEI

Semiconductor device with bump structure on an interconncet structure