P

Inventor

WAKABAYASHI TAKESHI

JP113 patents
⚠️ This page may combine multiple inventors who share the name “WAKABAYASHI TAKESHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CASIO COMPUTER CO LTD

20 patents
US6600234B2Jul 29, 2003

Mounting structure having columnar electrodes and a sealing film

CASIO COMPUTER CO LTD212 citations99
US6607970B1Aug 19, 2003

Semiconductor device and method of manufacturing the same

CASIO COMPUTER CO LTD146 citations98
US5108950AApr 28, 1992

Method for forming a bump electrode for a semiconductor device

CASIO COMPUTER CO LTD239 citations97
US7190064B2Mar 13, 2007

Semiconductor device and method of manufacturing the same

CASIO COMPUTER CO LTD56 citations96
US6603191B2Aug 5, 2003

Semiconductor device and method of manufacturing the same

CASIO COMPUTER CO LTD55 citations96
US6545354B1Apr 8, 2003

Semiconductor device having a barrier layer

CASIO COMPUTER CO LTD170 citations96
US7368813B2May 6, 2008

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

CASIO COMPUTER CO LTD14 citations93
US7075181B2Jul 11, 2006

Semiconductor package having semiconductor constructing body and method of manufacturing the same

CASIO COMPUTER CO LTD22 citations93
US6870256B2Mar 22, 2005

Semiconductor device having a thin-film circuit element provided above an integrated circuit

CASIO COMPUTER CO LTD35 citations93
US5538920AJul 23, 1996

Method of fabricating semiconductor device

CASIO COMPUTER CO LTD22 citations93
US5055859AOct 8, 1991

Integrated thermal printhead and driving circuit

CASIO COMPUTER CO LTD25 citations91
US6140155AOct 31, 2000

Method of manufacturing semiconductor device using dry photoresist film

CASIO COMPUTER CO LTD28 citations89
US7719116B2May 18, 2010

Semiconductor device having reduced number of external pad portions

CASIO COMPUTER CO LTD16 citations84
US7563640B2Jul 21, 2009

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

CASIO COMPUTER CO LTD10 citations84
US7514335B2Apr 7, 2009

Semiconductor device and method of manufacturing the same

CASIO COMPUTER CO LTD14 citations84
US7459340B2Dec 2, 2008

Semiconductor device and manufacturing method thereof

CASIO COMPUTER CO LTD9 citations84
US7417330B2Aug 26, 2008

Semiconductor device packaged into chip size and manufacturing method thereof

CASIO COMPUTER CO LTD9 citations84
US7390688B2Jun 24, 2008

Semiconductor device and manufacturing method thereof

CASIO COMPUTER CO LTD11 citations84
US7247947B2Jul 24, 2007

Semiconductor device comprising a plurality of semiconductor constructs

CASIO COMPUTER CO LTD16 citations84
US7816790B2Oct 19, 2010

Semiconductor device having low dielectric insulating film and manufacturing method of the same

CASIO COMPUTER CO LTD11 citations82

HONDA MOTOR CO LTD

15 patents

SHARP KK

9 patents

OMRON TATEISI ELECTRONICS CO

2 patents

TERA PROBE INC

1 patent

KAWASAKI HEAVY IND LTD

1 patent

NIPPON CMK KK

1 patent

WAKISAKA SHINJI

1 patent

Showing the top 50 of 113 patents by PatentIndex Score.