Inventor
MIHARA ICHIRO
JP45 patents
⚠️ This page may combine multiple inventors who share the name “MIHARA ICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CASIO COMPUTER CO LTD
32 patentsUS6600234B2Jul 29, 2003
Mounting structure having columnar electrodes and a sealing film
CASIO COMPUTER CO LTD212 citations99
US6501169B1Dec 31, 2002
Semiconductor device which prevents leakage of noise generated in a circuit element forming area and which shields against external electromagnetic noise
CASIO COMPUTER CO LTD193 citations99
US7294922B2Nov 13, 2007
Semiconductor device and method of manufacturing the same
CASIO COMPUTER CO LTD51 citations96
US7190064B2Mar 13, 2007
Semiconductor device and method of manufacturing the same
CASIO COMPUTER CO LTD56 citations96
US6545354B1Apr 8, 2003
Semiconductor device having a barrier layer
CASIO COMPUTER CO LTD170 citations96
US6467674B1Oct 22, 2002
Method of manufacturing semiconductor device having sealing film on its surface
CASIO COMPUTER CO LTD54 citations96
US7737543B2Jun 15, 2010
Semiconductor device and method of manufacturing the same
CASIO COMPUTER CO LTD14 citations93
US7618886B2Nov 17, 2009
Semiconductor device and method of manufacturing the same
CASIO COMPUTER CO LTD29 citations93
US7550833B2Jun 23, 2009
Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof
CASIO COMPUTER CO LTD42 citations93
US7547967B2Jun 16, 2009
Semiconductor device and method of manufacturing the same
CASIO COMPUTER CO LTD23 citations93
US7368813B2May 6, 2008
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
CASIO COMPUTER CO LTD14 citations93
US7112469B2Sep 26, 2006
Method of fabricating a semiconductor package utilizing a thermosetting resin base member
CASIO COMPUTER CO LTD39 citations93
US7064440B2Jun 20, 2006
Semiconductor device
CASIO COMPUTER CO LTD37 citations93
US6870256B2Mar 22, 2005
Semiconductor device having a thin-film circuit element provided above an integrated circuit
CASIO COMPUTER CO LTD35 citations93
US5556670ASep 17, 1996
Liquid crystal display panel
CASIO COMPUTER CO LTD52 citations92
US6140155AOct 31, 2000
Method of manufacturing semiconductor device using dry photoresist film
CASIO COMPUTER CO LTD28 citations89
US7719116B2May 18, 2010
Semiconductor device having reduced number of external pad portions
CASIO COMPUTER CO LTD16 citations84
US7563640B2Jul 21, 2009
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
CASIO COMPUTER CO LTD10 citations84
US7550843B2Jun 23, 2009
Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
CASIO COMPUTER CO LTD11 citations84
US7528480B2May 5, 2009
Circuit board, semiconductor device, and manufacturing method of circuit board
CASIO COMPUTER CO LTD19 citations84
US7514335B2Apr 7, 2009
Semiconductor device and method of manufacturing the same
CASIO COMPUTER CO LTD14 citations84
US7459340B2Dec 2, 2008
Semiconductor device and manufacturing method thereof
CASIO COMPUTER CO LTD9 citations84
US7417330B2Aug 26, 2008
Semiconductor device packaged into chip size and manufacturing method thereof
CASIO COMPUTER CO LTD9 citations84
US7390688B2Jun 24, 2008
Semiconductor device and manufacturing method thereof
CASIO COMPUTER CO LTD11 citations84
US7378645B2May 27, 2008
Optical sensor module with semiconductor device for drive
CASIO COMPUTER CO LTD13 citations84
US7247947B2Jul 24, 2007
Semiconductor device comprising a plurality of semiconductor constructs
CASIO COMPUTER CO LTD16 citations84
US7692282B2Apr 6, 2010
Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
CASIO COMPUTER CO LTD1 citations63
US6319851B1Nov 20, 2001
Method for packaging semiconductor device having bump electrodes
CASIO COMPUTER CO LTD6 citations63
US7445964B2Nov 4, 2008
Semiconductor device and method of manufacturing the same
CASIO COMPUTER CO LTD4 citations60
US7867826B2Jan 11, 2011
Semiconductor device packaged into chip size and manufacturing method thereof
CASIO COMPUTER CO LTD0 citations52
USRE41511EAug 17, 2010
Semiconductor device having a thin-film circuit element provided above an integrated circuit
CASIO COMPUTER CO LTD0 citations52
US7592672B2Sep 22, 2009
Grounding structure of semiconductor device including a conductive paste
CASIO COMPUTER CO LTD1 citations52
MIHARA ICHIRO
4 patentsUS8293574B2Oct 23, 2012
Semiconductor device having a plurality of semiconductor constructs
MIHARA ICHIRO9 citations83
US8507309B2Aug 13, 2013
Imaging apparatus having a photosensor provided on a lower surface of a semiconductor substrate and a lens unit provided on an upper surface of the semiconductor substrate, and manufacturing method of the same
MIHARA ICHIRO2 citations62
US8067274B2Nov 29, 2011
Method of forming wiring on a plurality of semiconductor devices from a single metal plate, and a semiconductor construction assembly formed by the method
MIHARA ICHIRO2 citations62
US8278734B2Oct 2, 2012
Semiconductor device and manufacturing method thereof
MIHARA ICHIRO1 citations51