P

Inventor

SCHULTZ MARK D

US85 patents
⚠️ This page may combine multiple inventors who share the name “SCHULTZ MARK D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

37 patents
US5612833AMar 18, 1997

Radial self-propagation pattern generation for disk file servowriting

IBM100 citations98
US6429989B1Aug 6, 2002

Method for self-servowriting timing propagation

IBM64 citations96
US10215504B2Feb 26, 2019

Flexible cold plate with enhanced flexibility

IBM25 citations94
US9052722B2Jun 9, 2015

Dynamically limiting energy consumed by cooling apparatus

IBM21 citations93
US7545648B2Jun 9, 2009

Cooling structure using rigid movable elements

IBM18 citations93
US7545647B2Jun 9, 2009

Compliant thermal interface structure utilizing spring elements

IBM18 citations93
US7408780B2Aug 5, 2008

Compliant thermal interface structure utilizing spring elements with fins

IBM24 citations93
US7362582B2Apr 22, 2008

Cooling structure using rigid movable elements

IBM22 citations93
US7355855B2Apr 8, 2008

Compliant thermal interface structure utilizing spring elements

IBM22 citations93
US10631438B2Apr 21, 2020

Mechanically flexible cold plates for low power components

IBM10 citations84
US10222125B2Mar 5, 2019

Burst resistant thin wall heat sink

IBM6 citations84
US9831151B1Nov 28, 2017

Heat sink for semiconductor modules

IBM12 citations84
US9634959B2Apr 25, 2017

High-density, fail-in-place switches for computer and data networks

IBM6 citations84
US9570373B1Feb 14, 2017

Near-chip compliant layer for reducing perimeter stress during assembly process

IBM10 citations84
US9534967B2Jan 3, 2017

Calibrating thermal behavior of electronics

IBM9 citations84
US9370122B2Jun 14, 2016

Cooling apparatus with a resilient heat conducting member

IBM10 citations84
US9354126B2May 31, 2016

Calibrating thermal behavior of electronics

IBM10 citations84
US7980445B2Jul 19, 2011

Fill head for full-field solder coverage with a rotatable member

IBM11 citations84
US7757932B2Jul 20, 2010

Method for step-down transition of a solder head in the injection molding soldering process

IBM8 citations84
US9941189B2Apr 10, 2018

Counter-flow expanding channels for enhanced two-phase heat removal

IBM7 citations83
US7505224B2Mar 17, 2009

Management of data cartridges in multiple-cartridge cells in an automated data storage library

IBM12 citations82
US9894801B1Feb 13, 2018

Cold plate

IBM8 citations80
US11800666B2Oct 24, 2023

Temporary removable module lid

IBM4 citations74
US7188667B2Mar 13, 2007

Liquid cooling structure for electronic device

IBM9 citations74
US11497143B2Nov 8, 2022

Mechanically flexible cold plates for low power components

IBM2 citations73
US11201102B2Dec 14, 2021

Module lid with embedded two-phase cooling and insulating layer

IBM6 citations73
US11158565B2Oct 26, 2021

Compliant pin fin heat sink and methods

IBM1 citations73
US10653044B2May 12, 2020

Energy efficiency based control for a cooling system

IBM3 citations73
US10440862B2Oct 8, 2019

Data center coolant switch

IBM2 citations73
US10342165B2Jul 2, 2019

Data center coolant switch

IBM1 citations73
US9997435B2Jun 12, 2018

Compliant pin fin heat sink and methods

IBM2 citations73
US9939210B2Apr 10, 2018

Pin fin compliant heat sink with enhanced flexibility

IBM4 citations73
US9702767B2Jul 11, 2017

Calibrating thermal behavior of electronics

IBM2 citations73
US10727159B2Jul 28, 2020

Counter-flow expanding channels for enhanced two-phase heat removal

IBM3 citations72
US12158314B2Dec 3, 2024

Reduced pressure drop cold plate transition

IBM0 citations63
US11737248B2Aug 22, 2023

Data center coolant switch

IBM0 citations63
US11698233B2Jul 11, 2023

Reduced pressure drop cold plate transition

IBM1 citations63

HITACHI GLOBAL STORAGE TECH

7 patents

CHAINER TIMOTHY J

4 patents

SCHULTZ MARK D

1 patent

KARIDIS JOHN P

1 patent

Showing the top 50 of 85 patents by PatentIndex Score.