Inventor · disambiguated record
Chin-Ching Huang
Also filed as: HUANG CHIN C · HUANG CHIN-CHING
16 granted patents·5 pending applications·237 citations·filing 1990–2021
93Inventor score
Files withVLSI TECHNOLOGY INC10LINGSEN PRECISION IND LTD4HUANG CHIN-CHING2XINTEC INC2LINGSEN PREC INDUCTRIES LTD1
Top patents by PatentIndex Score
21 records- 0185US11672819B2Polysaccharide carbon nanogels and anticoagulants and antioxidants comprising the sameUNIV NAT TAIWAN OCEAN·Filed 2021·Granted Jun 13, 2023·2 cites·15 claims
- 0271US5138431ALead and socket structures with reduced self-inductanceVLSI TECHNOLOGY INC·Filed 1990·Granted Aug 11, 1992·49 cites·20 claims
- 0367US5625225AMulti-layered, integrated circuit package having reduced parasitic noise characteristicsVLSI TECHNOLOGY INC·Filed 1996·Granted Apr 29, 1997·37 cites·2 claims
- 0466US10714528B2Chip package and manufacturing method thereofXINTEC INC·Filed 2018·Granted Jul 14, 2020·1 cites·19 claims
- 0561US5302022ATechnique for measuring thermal resistance of semiconductor packages and materialsVLSI TECHNOLOGY INC·Filed 1992·Granted Apr 12, 1994·27 cites·8 claims
- 0658US5371321APackage structure and method for reducing bond wire inductanceVLSI TECHNOLOGY INC·Filed 1992·Granted Dec 6, 1994·27 cites·15 claims
- 0756US5742009APrinted circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microeletronics packages via condution through the package leadsVLSI TECHNOLOGY CORP·Filed 1995·Granted Apr 21, 1998·19 cites·8 claims
- 0849US7884467B2Package structure of a microphoneLINGSEN PRECISION IND LTD·Filed 2008·Granted Feb 8, 2011·1 cites·14 claims
- 0949US5172471AMethod of providing power to an integrated circuitVLSI TECHNOLOGY INC·Filed 1991·Granted Dec 22, 1992·20 cites·6 claims
- 1048US7511373B2Cap package for micro electro-mechanical systemLINGSEN PREC INDUCTRIES LTD·Filed 2007·Granted Mar 31, 2009·1 cites·4 claims
- 1146US5641988AMulti-layered, integrated circuit package having reduced parasitic noise characteristicsVLSI TECHNOLOGY INC·Filed 1995·Granted Jun 24, 1997·14 cites·9 claims
- 1242US5371403AHigh performance package using high dielectric constant materials for power/ground and low dielectric constant materials for signal linesVLSI TECHNOLOGY INC·Filed 1993·Granted Dec 6, 1994·17 cites·16 claims
- 1341US10347616B2Chip package and manufacturing method thereofXINTEC INC·Filed 2017·Granted Jul 9, 2019·0 cites·7 claims
- 1440US5188982AMethod of bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequenceVLSI TECHNOLOGY INC·Filed 1991·Granted Feb 23, 1993·11 cites·11 claims
- 1539US2008164583A1Chip package capable of minimizing electro-magnetic interferenceLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 1638US6047467APrinted circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microelectronics packages via conduction through the package leadsVLSI TECHNOLOGY INC·Filed 1997·Granted Apr 11, 2000·6 cites·7 claims
- 1738US2007165898A1Acoustic head structure of a microphoneHUANG CHIN-CHING·Filed 2006·Application pending·0 cites
- 1837US2008079141A1Micro electro-mechanical system module package capable of minimizing interference of noisesLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 1937US2008164602A1Cap package for micro electro-mechanical system capable of minimizing electro-magnetic interferenceLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 2033US2007182002A1Package structure of a microphoneHUANG CHIN-CHING·Filed 2006·Application pending·0 cites
- 2132US5259545AApparatus for bonding a semiconductor die to a package using a gold/silicon preform and cooling the die and package through a monotonically decreasing temperature sequenceVLSI TECHNOLOGY INC·Filed 1992·Granted Nov 9, 1993·5 cites·8 claims
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