Inventor

LEI YU

US109 patents

⚠️ This page may combine multiple inventors who share the name “LEI YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEI YU

APPLIED MATERIALS INC

Method of enabling seamless cobalt gap-fill

Atomic layer deposition methods for metal gate electrodes

NMOS metal gate materials, manufacturing methods, and equipment using CVD and ALD processes with metal based precursors

Post deposition treatments for CVD cobalt films

Process integration approach of selective tungsten via fill

Method of enabling seamless cobalt gap-fill

Film deposition using spatial atomic layer deposition or pulsed chemical vapor deposition

Integrated platform for fabricating n-type metal oxide semiconductor (NMOS) devices

Methods for manufacturing metal gates

Directional selective junction clean with field polymer protections

Process integration approach of selective tungsten via fill

Methods for forming low-resistance contacts through integrated process flow systems

Selective tungsten deposition at low temperatures

Process kit for a substrate support

Deposition methods for uniform and conformal hybrid titanium oxide films

Chamber matching and calibration

Deposition of N-metal films comprising aluminum alloys

Process chamber manifold

Processing chamber with multiple plasma units

Processing chamber with multiple plasma units

Selective oxidation and simplified pre-clean

Blocker plate for use in a substrate process chamber

Blocker plate for use in a substrate process chamber

Directional selective junction clean with field polymer protections

Process kit for a substrate support

Selective tungsten deposition at low temperatures

Deposition of metal films with tungsten liner

Multi-step pre-clean for selective metal gap fill

Selective tungsten deposition within trench structures

Multi-step pre-clean for selective metal gap fill

Deposition of metal films with tungsten liner

Method of in-situ selective metal removal via gradient oxidation for gapfill

Lower edge ring of a process kit for semiconductor substrate processing

Lower edge ring of a process kit for semiconductor substrate processing

BEIJING BOE OPTOELECTRONICS TECH CO LTD

Wearable device, electronic system and device, tactile feedback method and storage medium

VR integrated machine and running method thereof

Display device, virtual reality display apparatus and display device control method

Display method and display device

GANGULI SESHADRI

NMOS metal gate materials, manufacturing methods, and equipment using CVD and ALD processes with metal based precursors

Metal gate structures and methods for forming thereof

LEI YU

Explosives detection substrate and methods of using the same

Post deposition treatments for CVD cobalt films

ZOPE BHUSHAN N

Method of enabling seamless cobalt gap-fill

UCHICAGO ARGONNE LLC

Coating of porous carbon for use in lithium air batteries

GRADUATE SCHOOL SHENZHEN TSINGHUA UNIV

Floating offshore wind turbine integrated with steel fish farming cage

INST MOUNTAIN HAZARDS & ENVIRONMENT CAS

Early warning method for icefall-caused moraine lake outburst disasters

QKM TECH DONG GUAN CO LTD

Method for detecting motor initial phase and phase sequence and system for controlling permanent-magnet synchronous motor

SHANGHAI INST MICROSYSTEM & INFORMATION TECH CAS

Read circuit of storage class memory with a read reference circuit, having same bit line parasitic parameters and same read transmission gate parasitic parameters as memory

FU XINYU

Methods for forming a contact metal layer in semiconductor devices

APPLIED MAT INC

Purge ring for a substrate processing chamber