Inventor
CHEW CHEE HIONG
MY95 patents
⚠️ This page may combine multiple inventors who share the name “CHEW CHEE HIONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
42 patentsUS9620877B2Apr 11, 2017
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC15 citations92
US11955412B2Apr 9, 2024
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11948870B2Apr 2, 2024
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11908840B2Feb 20, 2024
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11894347B2Feb 6, 2024
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11469163B2Oct 11, 2022
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11462515B2Oct 4, 2022
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US10720725B2Jul 21, 2020
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC8 citations84
US10319652B2Jun 11, 2019
Semiconductor package with elastic coupler and related methods
SEMICONDUCTOR COMPONENTS IND LLC5 citations84
US10199311B2Feb 5, 2019
Leadless semiconductor packages, leadframes therefor, and methods of making
SEMICONDUCTOR COMPONENTS IND LLC9 citations84
US9691732B2Jun 27, 2017
Semiconductor package with elastic coupler and related methods
SEMICONDUCTOR COMPONENTS IND LLC6 citations84
US9570832B2Feb 14, 2017
Press-fit pin for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC5 citations84
US11830856B2Nov 28, 2023
Semiconductor package and related methods
SEMICONDUCTOR COMPONENTS IND LLC8 citations83
US9679878B1Jun 13, 2017
Embedded stacked die packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC9 citations83
US11452225B2Sep 20, 2022
Fin frame assemblies
SEMICONDUCTOR COMPONENTS IND LLC4 citations73
US11404276B2Aug 2, 2022
Semiconductor packages with thin die and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US11342189B2May 24, 2022
Semiconductor packages with die including cavities and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US11342237B2May 24, 2022
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC4 citations73
US10861775B2Dec 8, 2020
Connecting clip design for pressure sintering
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US10861767B2Dec 8, 2020
Package structure with multiple substrates
SEMICONDUCTOR COMPONENTS IND LLC6 citations73
US10825748B2Nov 3, 2020
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US10693270B2Jun 23, 2020
Press-fit pin for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US10607903B2Mar 31, 2020
Semiconductor package with elastic coupler and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US10559905B2Feb 11, 2020
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC3 citations73
US10224655B2Mar 5, 2019
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US10121763B2Nov 6, 2018
Clip and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US9911712B2Mar 6, 2018
Clip and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US9431311B1Aug 30, 2016
Semiconductor package with elastic coupler and related methods
SEMICONDUCTOR COMPONENTS IND LLC3 citations73
US9941257B2Apr 10, 2018
Embedded stacked die packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC3 citations72
US9748163B1Aug 29, 2017
Die support for enlarging die size
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US11710687B2Jul 25, 2023
Semiconductor package with guide pin
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US11532539B2Dec 20, 2022
Semiconductor package with wettable flank
SEMICONDUCTOR COMPONENTS IND LLC1 citations71
US11348878B2May 31, 2022
Reinforced semiconductor die and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US12362266B2Jul 15, 2025
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US12355009B2Jul 8, 2025
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US12347812B2Jul 1, 2025
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US12347755B2Jul 1, 2025
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US12211775B2Jan 28, 2025
Multiple substrate package systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US11569140B2Jan 31, 2023
Semiconductor package with elastic coupler and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US11374373B2Jun 28, 2022
Press-fit pin for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US11217506B2Jan 4, 2022
Semiconductor device assemblies including low-stress spacer
SEMICONDUCTOR COMPONENTS IND LLC1 citations63
US9967986B2May 8, 2018
Semiconductor package and method therefor
SEMICONDUCTOR COMPONENTS IND LLC1 citations63
SEMICONDUCTOR COMPONENTS IND
5 patentsUS6475834B2Nov 5, 2002
Method of manufacturing a semiconductor component and semiconductor component thereof
SEMICONDUCTOR COMPONENTS IND23 citations87
USD755741SMay 10, 2016
Power device package
SEMICONDUCTOR COMPONENTS IND16 citations84
US7736951B2Jun 15, 2010
Circuit component and method of manufacture
SEMICONDUCTOR COMPONENTS IND11 citations81
US10756006B2Aug 25, 2020
Leadless semiconductor packages, leadframes therefor, and methods of making
SEMICONDUCTOR COMPONENTS IND1 citations73
US6472731B2Oct 29, 2002
Solder clad lead frame for assembly of semiconductor devices and method
SEMICONDUCTOR COMPONENTS IND2 citations63
MOTOROLA INC
2 patentsKRISHNAN SHUTESH
1 patentShowing the top 50 of 95 patents by PatentIndex Score.