Inventor
PRAJUCKAMOL ATAPOL
TH55 patents
⚠️ This page may combine multiple inventors who share the name “PRAJUCKAMOL ATAPOL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
46 patentsUS9620877B2Apr 11, 2017
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC15 citations92
US11955412B2Apr 9, 2024
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11948870B2Apr 2, 2024
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11908840B2Feb 20, 2024
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11894347B2Feb 6, 2024
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11469163B2Oct 11, 2022
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US11462515B2Oct 4, 2022
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC8 citations86
US10720725B2Jul 21, 2020
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC8 citations84
US9570832B2Feb 14, 2017
Press-fit pin for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC5 citations84
US11452225B2Sep 20, 2022
Fin frame assemblies
SEMICONDUCTOR COMPONENTS IND LLC4 citations73
US11342237B2May 24, 2022
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC4 citations73
US10861775B2Dec 8, 2020
Connecting clip design for pressure sintering
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US10861767B2Dec 8, 2020
Package structure with multiple substrates
SEMICONDUCTOR COMPONENTS IND LLC6 citations73
US10825748B2Nov 3, 2020
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US10693270B2Jun 23, 2020
Press-fit pin for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US10559905B2Feb 11, 2020
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC3 citations73
US10224655B2Mar 5, 2019
Flexible press fit pins for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC1 citations73
US10121763B2Nov 6, 2018
Clip and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US9911712B2Mar 6, 2018
Clip and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations73
US11710687B2Jul 25, 2023
Semiconductor package with guide pin
SEMICONDUCTOR COMPONENTS IND LLC2 citations71
US10056317B1Aug 21, 2018
Semiconductor package with grounding device and related methods
SEMICONDUCTOR COMPONENTS IND LLC2 citations67
US12362266B2Jul 15, 2025
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US12355009B2Jul 8, 2025
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US12347812B2Jul 1, 2025
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US12347755B2Jul 1, 2025
Low stress asymmetric dual side module
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US12211775B2Jan 28, 2025
Multiple substrate package systems and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US11374373B2Jun 28, 2022
Press-fit pin for semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations63
US11217506B2Jan 4, 2022
Semiconductor device assemblies including low-stress spacer
SEMICONDUCTOR COMPONENTS IND LLC1 citations63
US9967986B2May 8, 2018
Semiconductor package and method therefor
SEMICONDUCTOR COMPONENTS IND LLC1 citations63
US12394692B2Aug 19, 2025
Power circuit module
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12308297B2May 20, 2025
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12300558B2May 13, 2025
Substrates and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US12033904B2Jul 9, 2024
Semiconductor package system and related methods
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11804421B2Oct 31, 2023
Connecting clip design for pressure sintering
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11672087B2Jun 6, 2023
Semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11272625B2Mar 8, 2022
Method for forming a semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC1 citations62
US10971428B2Apr 6, 2021
Semiconductor baseplates
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10966335B2Mar 30, 2021
Fin frame assemblies
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10897821B2Jan 19, 2021
Method of making single reflow power pin connections
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US10231340B2Mar 12, 2019
Single reflow power pin connections
SEMICONDUCTOR COMPONENTS IND LLC1 citations62
US12283562B2Apr 22, 2025
Clip design and method of controlling clip position
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US12525519B2Jan 13, 2026
Semiconductor package with guide pin
SEMICONDUCTOR COMPONENTS IND LLC0 citations60
US11081828B2Aug 3, 2021
Power module housing
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
USD922329SJun 15, 2021
Press-fit pin case
SEMICONDUCTOR COMPONENTS IND LLC0 citations59
US10971429B2Apr 6, 2021
Method for forming a semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations56
US10607920B2Mar 31, 2020
Semiconductor package
SEMICONDUCTOR COMPONENTS IND LLC0 citations48
SEMICONDUCTOR COMPONENTS IND
3 patentsPRAJUCKAMOL ATAPOL
1 patentShowing the top 50 of 55 patents by PatentIndex Score.