Inventor · disambiguated record
Adrian Arcedera
Also filed as: ARCEDERA ADRIAN
13 granted patents·5 pending applications·38 citations·filing 2010–2025
88Inventor score
Top patents by PatentIndex Score
18 records- 0191US9932221B1Semiconductor package with multiple compartmentsAMKOR TECHNOLOGY INC·Filed 2017·Granted Apr 3, 2018·11 cites·20 claims
- 0285US10221064B2Semiconductor package with multiple compartmentsAMKOR TECHNOLOGY INC·Filed 2018·Granted Mar 5, 2019·4 cites·20 claims
- 0385US7999371B1Heat spreader package and methodAMKOR TECHNOLOGY INC·Filed 2010·Granted Aug 16, 2011·10 cites·20 claims
- 0481US8441120B1Heat spreader packageARCEDERA ADRIAN·Filed 2011·Granted May 14, 2013·9 cites·20 claims
- 0578US12187603B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 0678US10843918B2Semiconductor package with multiple compartmentsAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 24, 2020·2 cites·17 claims
- 0770US11572269B2Semiconductor package using a polymer substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 0869US10032726B1Embedded vibration management systemAMKOR TECHNOLOGY INC·Filed 2013·Granted Jul 24, 2018·2 cites·23 claims
- 0968US12480828B2Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Nov 25, 2025·0 cites·16 claims
- 1068US11505452B2Semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 22, 2022·0 cites·16 claims
- 1165US2024194544A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1260US10822226B2Semiconductor package using a polymer substrateAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 1356US2025248152A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 1455US11908755B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Feb 20, 2024·0 cites·18 claims
- 1555US10861798B2Embedded vibration management system having an array of vibration absorbing structuresAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 8, 2020·0 cites·20 claims
- 1647US2016221820A1Semiconductor package using a polymer substrateAMKOR TECHNOLOGY INC·Filed 2016·Application pending·0 cites
- 1745US2022415733A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Application pending·0 cites
- 1839US2025351598A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Adrian Arcedera files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →