Inventor · disambiguated record
Adolf Koller
Also filed as: KOLLER ADOLF
26 granted patents·5 pending applications·80 citations·filing 2005–2022
94Inventor score
Top patents by PatentIndex Score
31 records- 0187US8883565B2Separation of semiconductor devices from a wafer carrierVAUPEL MATHIAS·Filed 2011·Granted Nov 11, 2014·13 cites·32 claims
- 0287US8809120B2Method of dicing a waferMICCOLI GIUSEPPE·Filed 2011·Granted Aug 19, 2014·13 cites·4 claims
- 0386US7830022B2Semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 9, 2010·12 cites·24 claims
- 0483US9040389B2Singulation processesINFINEON TECHNOLOGIES AG·Filed 2012·Granted May 26, 2015·8 cites·29 claims
- 0581US7863104B2Method of producing a thin semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jan 4, 2011·8 cites·22 claims
- 0678US7799659B2Singulating semiconductor wafers to form semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 21, 2010·6 cites·15 claims
- 0774US9147624B2Chip comprising a backside metal stackINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 29, 2015·2 cites·13 claims
- 0873US8164173B2Panel, semiconductor device and method for the production thereofKOLLER ADOLF·Filed 2010·Granted Apr 24, 2012·3 cites·13 claims
- 0972US10748801B2Carrier arrangement and method for processing a carrier by generating a crack structureINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 18, 2020·1 cites·13 claims
- 1071US8017942B2Semiconductor device and methodINFINEON TECHNOLOGIES AG·Filed 2008·Granted Sep 13, 2011·4 cites·14 claims
- 1171US7772693B2Panel, semiconductor device and method for the production thereofINFINEON TECHNOLOGIES AG·Filed 2007·Granted Aug 10, 2010·4 cites·30 claims
- 1266US8323996B2Semiconductor deviceKOLLER ADOLF·Filed 2009·Granted Dec 4, 2012·2 cites·24 claims
- 1365US8289019B2SensorKOLLER ADOLF·Filed 2009·Granted Oct 16, 2012·3 cites·23 claims
- 1459US10460972B2Method of detaching semiconductor material from a carrier and device for performing the methodINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 29, 2019·1 cites·13 claims
- 1554US2023066813A1Wafer, electronic component and method using laser penetration affecting structureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1653US8785234B2Method for manufacturing a plurality of chipsINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 22, 2014·0 cites·24 claims
- 1752US9040354B2Chip comprising a fill structureINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 26, 2015·0 cites·28 claims
- 1852US8993372B2Method for producing a semiconductor componentSCHNEEGANS MANFRED·Filed 2012·Granted Mar 31, 2015·0 cites·22 claims
- 1951US11939216B2Method with stealth dicing process for fabricating MEMS semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 26, 2024·0 cites·14 claims
- 2050US2014329373A1Method of Dicing a WaferINFINEON TECHNOLOGIES AG·Filed 2014·Application pending·0 cites
- 2149US10043701B2Substrate removal from a carrierINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 7, 2018·0 cites·14 claims
- 2249US10029913B2Removal of a reinforcement ring from a waferINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 24, 2018·0 cites·21 claims
- 2349US8207018B2Semiconductor packageTHEUSS HORST·Filed 2010·Granted Jun 26, 2012·0 cites·20 claims
- 2448US10522478B2Semiconductor device with circumferential structure and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2018·Granted Dec 31, 2019·0 cites·20 claims
- 2548US10107875B2GMR sensor within molded magnetic material employing non-magnetic spacerELIAN KLAUS·Filed 2009·Granted Oct 23, 2018·0 cites·15 claims
- 2647US8704338B2Chip comprising a fill structureMACKH GUNTHER·Filed 2011·Granted Apr 22, 2014·0 cites·19 claims
- 2744US10811297B2Wafer expanderINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 20, 2020·0 cites·15 claims
- 2841US8482019B2Electronic light emitting device and method for fabricating the sameKOLLER ADOLF·Filed 2010·Granted Jul 9, 2013·0 cites·26 claims
- 2940US2006001116A1Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its productionAUBURGER ALBERT·Filed 2005·Application pending·0 cites
- 3035US2018233470A1Handling thin wafer during chip manufactureINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 3132US2016211227A1Semiconductor Device Including a Protection StructureINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →