Inventor · disambiguated record
Ai-Sen Liu
Also filed as: LIU AI-SEN
28 granted patents·15 pending applications·225 citations·filing 2002–2024
95Inventor score
Files withINGENTEC CORP16TAIWAN SEMICONDUCTOR MFG15EPISTAR CORP6UNITED MICROELECTRONICS CORP3AU OPTRONICS CORP1
Top patents by PatentIndex Score
43 records- 0195US7176137B2Method for multiple spacer width controlTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 13, 2007·101 cites·20 claims
- 0285US11552222B2Display deviceLEXTAR ELECTRONICS CORP·Filed 2020·Granted Jan 10, 2023·2 cites·22 claims
- 0383US6943077B2Selective spacer layer deposition method for forming spacers with different widthsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 13, 2005·24 cites·21 claims
- 0481US11508872B2Alignment module for transferring a magnetic light-emitting die and alignment method thereofINGENTEC CORP·Filed 2021·Granted Nov 22, 2022·1 cites·20 claims
- 0578US6895360B2Method to measure oxide thickness by FTIR to improve an in-line CMP endpoint determinationTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 17, 2005·19 cites·14 claims
- 0673US6972253B2Method for forming dielectric barrier layer in damascene structureTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Dec 6, 2005·19 cites·54 claims
- 0773US6746900B1Method for forming a semiconductor device having high-K gate dielectric materialTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 8, 2004·17 cites·25 claims
- 0871US8053894B2Surface treatment of metal interconnect linesTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 8, 2011·3 cites·24 claims
- 0970US6955984B2Surface treatment of metal interconnect linesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·12 cites·34 claims
- 1069US7633588B2Fringe field switching LCD having smectic liquid crystal and utilizing alternate current squared wave driving voltageAU OPTRONICS CORP·Filed 2005·Granted Dec 15, 2009·4 cites·15 claims
- 1168US9966425B1Method for fabricating a MIM capacitorUNITED MICROELECTRONICS CORP·Filed 2017·Granted May 8, 2018·1 cites·14 claims
- 1266US12487188B2Wafer defect analyzing device and wafer defect analyzing methodINGENTEC CORP·Filed 2024·Granted Dec 2, 2025·0 cites·15 claims
- 1364US7083495B2Advanced process control approach for Cu interconnect wiring sheet resistance controlTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Aug 1, 2006·9 cites·29 claims
- 1463US7271103B2Surface treated low-k dielectric as diffusion barrier for copper metallizationTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 18, 2007·8 cites·12 claims
- 1563US2024178631A1Laser diode and laser diode manufacturing methodINGENTEC CORP·Filed 2023·Application pending·0 cites
- 1661US2025267982A1Vertical light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1761US2025287727A1Light emitting diode chip and manufacturing method thereofINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1857US2025331344A1Light emitting diode pixel package and manufacturing method for light emitting diode pixel packageINGENTEC CORP·Filed 2024·Application pending·0 cites
- 1956US12417964B2Via-filling method of through-glass via substrateINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·8 claims
- 2055US2025233028A1Micro-led wafer testing device and micro-led wafer testing methodINGENTEC CORP·Filed 2024·Application pending·0 cites
- 2155US2014203322A1Transparent Conductive Structure, Device comprising the same, and the Manufacturing Method thereofEPISTAR CORP·Filed 2013·Application pending·0 cites
- 2254US12418011B2Bonding and transferring method for die package structuresINGENTEC CORP·Filed 2023·Granted Sep 16, 2025·0 cites·15 claims
- 2352US7338909B2Micro-etching method to replicate alignment marks for semiconductor wafer photolithographyTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 4, 2008·5 cites·42 claims
- 2451US2024339579A1Light-emitting diode package structure and manufacturing method thereofINGENTEC CORP·Filed 2023·Application pending·0 cites
- 2550US12489093B2Magnetic LED die transferring device and magnetic LED die transferring methodINGENTEC CORP·Filed 2023·Granted Dec 2, 2025·0 cites·10 claims
- 2650US2023170434A1Vertical light-emitting diode and method for fabricating the sameINGENTEC CORP·Filed 2022·Application pending·0 cites
- 2749US2024304749A1Encapsulation process method for wafer-level light-emitting diode diesINGENTEC CORP·Filed 2023·Application pending·0 cites
- 2848US9583680B2Transparent conductive structure, device comprising the same, and the manufacturing method thereofEPISTAR CORP·Filed 2015·Granted Feb 28, 2017·0 cites·20 claims
- 2948US9520281B2Method of fabricating an optoelectronic device with a hollow component in epitaxial layerEPISTAR CORP·Filed 2014·Granted Dec 13, 2016·0 cites·14 claims
- 3048US2006113616A1Selective spacer layer deposition method for forming spacers with different widthsLIU AI-SEN·Filed 2005·Application pending·0 cites
- 3147US11769861B2Light-emitting diode packaging structure and method for fabricating the sameINGENTEC CORP·Filed 2021·Granted Sep 26, 2023·0 cites·8 claims
- 3247US2005133931A1SiOC properties and its uniformity in bulk for damascene applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3346US12150242B2LED circuit board structure and LED testing and packaging methodINGENTEC CORP·Filed 2022·Granted Nov 19, 2024·0 cites·7 claims
- 3446US9926488B2PhosphorEPISTAR CORP·Filed 2015·Granted Mar 27, 2018·0 cites·13 claims
- 3546US2024006557A1Led circuit board structure, led testing and packaging method and led pixel packageINGENTEC CORP·Filed 2022·Application pending·0 cites
- 3644US10504594B1Non-volatile memory and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 3742US2017002463A1Showerhead and a thin-film deposition apparatus containing the sameEPISTAR CORP·Filed 2016·Application pending·0 cites
- 3841US2017088773A1Material of phosphor and a manufacturing method thereofEPISTAR CORP·Filed 2016·Application pending·0 cites
- 3940US6884149B2Method and system for in-situ monitoring of mixing ratio of high selectivity slurryTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 26, 2005·0 cites·8 claims
- 4039US6948238B2Method for dissociating metals from metal compoundsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 27, 2005·0 cites·9 claims
- 4138US6729935B2Method and system for in-situ monitoring of mixing ratio of high selectivity slurryTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 4, 2004·0 cites·18 claims
- 4238US2019229053A1Metal-insulator-metal capacitor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 4335US7011929B2Method for forming multiple spacer widthsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 14, 2006·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →