Inventor · disambiguated record
Akifumi Gawase
Also filed as: GAWASE AKIFUMI
30 granted patents·29 pending applications·39 citations·filing 2009–2025
94Inventor score
Top patents by PatentIndex Score
59 records- 0196US11502204B2Semiconductor device and semiconductor memory deviceKIOXIA CORP·Filed 2021·Granted Nov 15, 2022·3 cites·20 claims
- 0294US11349033B2Semiconductor device and semiconductor memory deviceKIOXIA CORP·Filed 2020·Granted May 31, 2022·3 cites·20 claims
- 0392US9646989B1Three-dimensional memory deviceTOSHIBA KK·Filed 2016·Granted May 9, 2017·12 cites·15 claims
- 0486US10850363B2Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted Dec 1, 2020·3 cites·7 claims
- 0584US9837279B2Manufacturing method of semiconductor device and semiconductor device manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2016·Granted Dec 5, 2017·3 cites·10 claims
- 0680US8871644B2Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2013·Granted Oct 28, 2014·4 cites·20 claims
- 0778US9144879B2Planarization method and planarization apparatusTOSHIBA KK·Filed 2013·Granted Sep 29, 2015·3 cites·7 claims
- 0877US2025336815A1Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2025·Application pending·0 cites
- 0970US10195716B2Dresser, method of manufacturing dresser, and method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Feb 5, 2019·1 cites·18 claims
- 1069US11978807B2Semiconductor device and semiconductor memory deviceKIOXIA CORP·Filed 2022·Granted May 7, 2024·0 cites·16 claims
- 1169US8703004B2Method for chemical planarization and chemical planarization apparatusMATSUI YUKITERU·Filed 2012·Granted Apr 22, 2014·2 cites·20 claims
- 1268US12381144B2Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2022·Granted Aug 5, 2025·0 cites·20 claims
- 1367US11883926B2Polishing pad, semiconductor fabricating device and fabricating method of semiconductor deviceKIOXIA CORP·Filed 2021·Granted Jan 30, 2024·0 cites·16 claims
- 1464US12477718B2Semiconductor device and semiconductor memory device each having portions of oxide semiconductor between gate insulating layer and electrodesKIOXIA CORP·Filed 2022·Granted Nov 18, 2025·0 cites·20 claims
- 1564US10121677B2Manufacturing method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2016·Granted Nov 6, 2018·1 cites·10 claims
- 1663US8936729B2Planarizing methodGAWASE AKIFUMI·Filed 2012·Granted Jan 20, 2015·2 cites·17 claims
- 1763US7781301B2Method of fabricating semiconductor deviceTOSHIBA KK·Filed 2009·Granted Aug 24, 2010·2 cites·20 claims
- 1862US2025081436A1Semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 1962US2025107074A1Semiconductor deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 2062US2022262954A1Semiconductor device and semiconductor memory deviceKIOXIA CORP·Filed 2022·Application pending·0 cites
- 2159US2024324179A1Semiconductor device and method of manufacturing the sameKIOXIA CORP·Filed 2024·Application pending·0 cites
- 2259US2025098248A1Semiconductor device manufacturing method and semiconductor manufacturing apparatusKIOXIA CORP·Filed 2024·Application pending·0 cites
- 2358US12065725B2Film forming apparatus and film forming methodKIOXIA CORP·Filed 2020·Granted Aug 20, 2024·0 cites·21 claims
- 2458US2025301754A1Semiconductor device, semiconductor memory device, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 2556US10991588B2Manufacturing method of semiconductor device and semiconductor device manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2017·Granted Apr 27, 2021·0 cites·26 claims
- 2656US10010997B2Abrasive cloth and polishing methodTOSHIBA MEMORY CORP·Filed 2015·Granted Jul 3, 2018·0 cites·16 claims
- 2755US11534886B2Polishing device, polishing head, polishing method, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted Dec 27, 2022·0 cites·20 claims
- 2855US9174322B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2014·Granted Nov 3, 2015·0 cites·20 claims
- 2955US2024324178A1Semiconductor device and semiconductor memory deviceKIOXIA CORP·Filed 2024·Application pending·0 cites
- 3053US2019283206A1Polishing pad, semiconductor fabricating device and fabricating method of semiconductor deviceTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 3153US2014187042A1Method for chemical planarization and chemical planarization apparatusTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3253US2019259777A1Semiconductor device and method for manufacturing sameTOSHIBA MEMORY CORP·Filed 2019·Application pending·0 cites
- 3352US2018277388A1Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2018·Application pending·0 cites
- 3452US2024084456A1Film forming apparatus, and method of manufacturing semiconductor deviceKIOXIA CORP·Filed 2023·Application pending·0 cites
- 3551US10283383B2Planarization method and planarization apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted May 7, 2019·0 cites·13 claims
- 3651US2024098962A1Semiconductor device and semiconductor memory deviceKIOXIA CORP·Filed 2023·Application pending·0 cites
- 3749US10985027B2Method for manufacturing semiconductor deviceKIOXIA CORP·Filed 2020·Granted Apr 20, 2021·0 cites·20 claims
- 3849US10008390B2Manufacturing method of semiconductor device and semiconductor manufacturing apparatusTOSHIBA MEMORY CORP·Filed 2015·Granted Jun 26, 2018·0 cites·12 claims
- 3949US2025301629A1Oxide semiconductor-based dynamic random access memory (dram) deviceKIOXIA CORP·Filed 2025·Application pending·0 cites
- 4047US12432907B2Semiconductor device and semiconductor memory deviceKIOXIA CORP·Filed 2023·Granted Sep 30, 2025·0 cites·30 claims
- 4147US10319734B2Semiconductor memory device having air gapTOSHIBA MEMORY CORP·Filed 2016·Granted Jun 11, 2019·0 cites·7 claims
- 4246US10079153B2Semiconductor storage deviceTOSHIBA MEMORY CORP·Filed 2017·Granted Sep 18, 2018·0 cites·17 claims
- 4346US2013331004A1Semiconductor device manufacturing method and chemical mechanical polishing methodJSR CORP·Filed 2013·Application pending·0 cites
- 4446US2013331005A1Semiconductor device manufacturing methodTOSHIBA KK·Filed 2013·Application pending·0 cites
- 4546US2022048155A1Polishing apparatus and polishing methodKIOXIA CORP·Filed 2021·Application pending·0 cites
- 4645US10998283B2Semiconductor device production methodTOSHIBA MEMORY CORP·Filed 2019·Granted May 4, 2021·0 cites·10 claims
- 4745US9012246B2Manufacturing method of semiconductor device and polishing apparatusTOSHIBA KK·Filed 2013·Granted Apr 21, 2015·0 cites·12 claims
- 4843US2020298363A1Polishing device and polishing methodTOSHIBA MEMORY CORP·Filed 2019·Application pending·0 cites
- 4943US2014073136A1Semiconductor device manufacturing methodTOSHIBA KK·Filed 2013·Application pending·0 cites
- 5042US9558961B2Manufacturing method of semiconductor deviceTOSHIBA KK·Filed 2016·Granted Jan 31, 2017·0 cites·12 claims
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →