Inventor · disambiguated record
Akihiko Kameoka
Also filed as: KAMEOKA AKIHIKO
17 granted patents·5 pending applications·298 citations·filing 1996–2010
93Inventor score
Technology areasH10W
Top patents by PatentIndex Score
22 records- 0196US6291273B1Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 1996·Granted Sep 18, 2001·208 cites·18 claims
- 0287US7466024B2Multi-chip semiconductor device packageRENESAS TECH CORP·Filed 2006·Granted Dec 16, 2008·11 cites·2 claims
- 0383US7998795B2Method of manufacturing a semiconductor device including plural semiconductor chipsRENESAS ELECTRONICS CORP·Filed 2010·Granted Aug 16, 2011·5 cites·1 claims
- 0481US7772044B2Method of manufacturing a semiconductor device including plural semiconductor chipsRENESAS TECH CORP·Filed 2008·Granted Aug 10, 2010·7 cites·6 claims
- 0565US7247576B2Method of manufacturing a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jul 24, 2007·2 cites·4 claims
- 0665US6558980B2Plastic molded type semiconductor device and fabrication process thereofFiled 2001·Granted May 6, 2003·11 cites·8 claims
- 0765US6396142B1Semiconductor deviceHITACHI LTD·Filed 1999·Granted May 28, 2002·21 cites·23 claims
- 0861US7199469B2Semiconductor device having stacked semiconductor chips sealed with a resin seal memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2001·Granted Apr 3, 2007·12 cites·4 claims
- 0958US6989334B2Manufacturing method of a semiconductor deviceHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jan 24, 2006·6 cites·8 claims
- 1057US6943456B2Plastic molded type semiconductor device and fabrication process thereofHITACHI LTD·Filed 2004·Granted Sep 13, 2005·6 cites·7 claims
- 1157US6803258B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Oct 12, 2004·5 cites·8 claims
- 1252US7678706B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Mar 16, 2010·0 cites·7 claims
- 1351US7989267B2Manufacturing method of semiconductor device and manufacturing method of lead frameRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 2, 2011·0 cites·2 claims
- 1449US6673655B2Method of making semiconductor device having improved heat radiation plate arrangementHITACHI LTD·Filed 2002·Granted Jan 6, 2004·2 cites·7 claims
- 1548US2005230793A1Semiconductor deviceITO FUJIO·Filed 2005·Application pending·0 cites
- 1647US7374973B2Manufacturing method of semiconductor device and manufacturing method of lead frameRENESAS TECH CORP·Filed 2005·Granted May 20, 2008·0 cites·16 claims
- 1747US6692989B2Plastic molded type semiconductor device and fabrication process thereofRENESAS TECH CORP·Filed 2003·Granted Feb 17, 2004·2 cites·8 claims
- 1841US2006199302A1Semiconductor device and a manufacturing method of the sameITO FUJIO·Filed 2006·Application pending·0 cites
- 1941US2004126932A1Semiconductor deviceFiled 2003·Application pending·0 cites
- 2040US2002192871A1Semiconductor deviceFiled 2002·Application pending·0 cites
- 2136US6791182B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Sep 14, 2004·0 cites·40 claims
- 2236US2003052420A1Semiconductor deviceHITACHI LTD·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Akihiko Kameoka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →