Inventor · disambiguated record
Akihiko Ogawa
Also filed as: OGAWA AKIHIKO
9 granted patents·80 citations·filing 1998–2020
85Inventor score
Top patents by PatentIndex Score
9 records- 0181US8078419B2Polishing monitoring method and polishing apparatusKOBAYASHI YOICHI·Filed 2008·Granted Dec 13, 2011·8 cites·5 claims
- 0272US6041840AVacuum lamination device and a vacuum lamination methodMEIKI SEISAKUSHO KK·Filed 1998·Granted Mar 28, 2000·48 cites·5 claims
- 0359US8454407B2Polishing method and apparatusTAKAHASHI TARO·Filed 2009·Granted Jun 4, 2013·2 cites·9 claims
- 0457US9068814B2Polishing monitoring method, polishing apparatus and monitoring apparatusTAKAHASHI TARO·Filed 2008·Granted Jun 30, 2015·3 cites·4 claims
- 0557US6738763B1Information retrieval system having consistent search results across different operating systems and data base management systemsFUJITSU LTD·Filed 2000·Granted May 18, 2004·8 cites·12 claims
- 0656US10625390B2Polishing apparatus and polishing methodEBARA CORP·Filed 2017·Granted Apr 21, 2020·0 cites·14 claims
- 0756US6469643B1Information processing systemFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·11 cites·6 claims
- 0845US11633828B2Substrate polishing system, substrate polishing method and substrate polishing apparatusEBARA CORP·Filed 2020·Granted Apr 25, 2023·0 cites·8 claims
- 0940US10890899B2Method of semiconductor manufacturing apparatus and non-transitory computer-readable storage medium storing a program of causing computer to execute design method of semiconductor manufacturing apparatusEBARA CORP·Filed 2018·Granted Jan 12, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →