Inventor · disambiguated record
Akito Yoshida
Also filed as: YOSHIDA AKITO
38 granted patents·1,021 citations·filing 1985–2023
98Inventor score
Files withAMKOR TECHNOLOGY INC16TOSHIBA KK6YOSHIDA AKITO6SUMITOMO ELECTRIC INDUSTRIES5AMKOR TECH SINGAPORE HOLDING PTE LTD3
Top patents by PatentIndex Score
38 records- 0198US9012789B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2014·Granted Apr 21, 2015·31 cites·20 claims
- 0298US8222538B1Stackable via package and methodYOSHIDA AKITO·Filed 2009·Granted Jul 17, 2012·91 cites·20 claims
- 0397US8471154B1Stackable variable height via package and methodYOSHIDA AKITO·Filed 2009·Granted Jun 25, 2013·71 cites·18 claims
- 0497US6987314B1Stackable semiconductor package with solder on pads on which second semiconductor package is stackedAMKOR TECHNOLOGY INC·Filed 2004·Granted Jan 17, 2006·106 cites·24 claims
- 0595US9730327B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 8, 2017·10 cites·20 claims
- 0695US8704368B1Stackable via package and methodYOSHIDA AKITO·Filed 2012·Granted Apr 22, 2014·15 cites·16 claims
- 0795US8623753B1Stackable protruding via package and methodYOSHIDA AKITO·Filed 2009·Granted Jan 7, 2014·41 cites·21 claims
- 0894US6326243B1Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resinTOSHIBA KK·Filed 1997·Granted Dec 4, 2001·200 cites·12 claims
- 0993US10206285B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2018·Granted Feb 12, 2019·5 cites·20 claims
- 1093US8300423B1Stackable treated via package and methodDARVEAUX ROBERT FRANCIS·Filed 2010·Granted Oct 30, 2012·18 cites·19 claims
- 1190US4632817AMethod of synthesizing diamondSUMITOMO ELECTRIC INDUSTRIES·Filed 1985·Granted Dec 30, 1986·62 cites·13 claims
- 1289US10034372B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2017·Granted Jul 24, 2018·3 cites·20 claims
- 1389US7652361B1Land patterns for a semiconductor stacking structure and method thereforAMKOR TECHNOLOGY INC·Filed 2006·Granted Jan 26, 2010·20 cites·16 claims
- 1489US6445001B2Semiconductor device with flip-chip structure and method of manufacturing the sameTOSHIBA KK·Filed 1997·Granted Sep 3, 2002·67 cites·11 claims
- 1586US7982306B1Stackable semiconductor packageAMKOR TECHNOLOGY INC·Filed 2010·Granted Jul 19, 2011·5 cites·23 claims
- 1686US7459349B1Method of forming a stack of semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·9 cites·20 claims
- 1785US12035472B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jul 9, 2024·0 cites·20 claims
- 1882US10257942B1Stackable variable height via package and methodAMKOR TECHNOLOGY INC·Filed 2013·Granted Apr 9, 2019·5 cites·20 claims
- 1982US6750545B1Semiconductor package capable of die stackingAMKOR TECHNOLOGY INC·Filed 2003·Granted Jun 15, 2004·34 cites·23 claims
- 2081US5133332ADiamond toolSUMITOMO ELECTRIC INDUSTRIES·Filed 1991·Granted Jul 28, 1992·41 cites·3 claims
- 2179US7737542B1Stackable semiconductor packageAMKOR TECHNOLOGY INC·Filed 2008·Granted Jun 15, 2010·5 cites·20 claims
- 2277US11700692B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Jul 11, 2023·0 cites·22 claims
- 2376US7429799B1Land patterns for a semiconductor stacking structure and method thereforAMKOR TECHNOLOGY INC·Filed 2005·Granted Sep 30, 2008·6 cites·20 claims
- 2476US6007916ASynthetic single crystal diamond for wiring drawing dies and process for producing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1994·Granted Dec 28, 1999·25 cites·3 claims
- 2574US11089685B2Stackable via package and methodAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 10, 2021·0 cites·20 claims
- 2674US8227905B1Stackable semiconductor packageYOSHIDA AKITO·Filed 2011·Granted Jul 24, 2012·2 cites·19 claims
- 2770US7154171B1Stacking structure for semiconductor devices using a folded over flexible substrate and method thereforAMKOR TECHNOLOGY INC·Filed 2002·Granted Dec 26, 2006·16 cites·20 claims
- 2869US5291374ASemiconductor device having an opening and method of manufacturing the sameTOSHIBA KK·Filed 1991·Granted Mar 1, 1994·41 cites·20 claims
- 2967US10548221B1Stackable via package and methodAMKOR TECHNOLOGY INC·Filed 2019·Granted Jan 28, 2020·0 cites·20 claims
- 3061US5753969AResin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resinTOSHIBA KK·Filed 1996·Granted May 19, 1998·25 cites·9 claims
- 3160US7691745B1Land patterns for a semiconductor stacking structure and method thereforAMKOR TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·1 cites·20 claims
- 3260US5785039ASingle-crystalline diamond tip for dresser and dresser employing the sameSUMITOMO ELECTRIC INDUSTRIES·Filed 1996·Granted Jul 28, 1998·20 cites·7 claims
- 3354US8466545B1Stackable semiconductor packageYOSHIDA AKITO·Filed 2012·Granted Jun 18, 2013·0 cites·20 claims
- 3452US5329068ASemiconductor deviceTOSHIBA KK·Filed 1993·Granted Jul 12, 1994·20 cites·6 claims
- 3550US11236001B2Hydrothermal treatment device, biomass fuel manufacturing plant, hydrothermal treatment method, and biomass fuel manufacturing methodMITSUBISHI POWER LTD·Filed 2019·Granted Feb 1, 2022·0 cites·18 claims
- 3649US8022521B1Package failure prognostic structure and methodAMKOR TECHNOLOGY INC·Filed 2008·Granted Sep 20, 2011·0 cites·18 claims
- 3745US5560241ASynthetic single crystal diamond for wire drawing diesSUMITOMO ELECTRIC INDUSTRIES·Filed 1995·Granted Oct 1, 1996·12 cites·5 claims
- 3844US5157476ATape carrier having improved test padsTOSHIBA KK·Filed 1991·Granted Oct 20, 1992·14 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →