Inventor · disambiguated record
Alex Buxbaum
Also filed as: BUXBAUM ALEX
11 granted patents·10 pending applications·104 citations·filing 2001–2025
88Inventor score
Top patents by PatentIndex Score
21 records- 0192US6582861B2Method of reshaping a patterned organic photoresist surfaceAPPLIED MATERIALS INC·Filed 2001·Granted Jun 24, 2003·46 cites·27 claims
- 0285US6703169B2Method of preparing optically imaged high performance photomasksAPPLIED MATERIALS INC·Filed 2001·Granted Mar 9, 2004·26 cites·15 claims
- 0382US7244334B2Apparatus used in reshaping a surface of a photoresistAPPLIED MATERIALS INC·Filed 2005·Granted Jul 17, 2007·5 cites·11 claims
- 0478US2025357165A1Methods of cross-section imaging of an inspection volume in a waferZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0578US2024328970A1Method of 3d volume inspection of semiconductor wafers with increased throughputZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 0673US6998206B2Method of increasing the shelf life of a blank photomask substrateAPPLIED MATERIALS INC·Filed 2004·Granted Feb 14, 2006·12 cites·11 claims
- 0768US2025239474A1Contact area size determination between 3d structures in an integrated semiconductor sampleZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0867US12283504B2Contact area size determination between 3D structures in an integrated semiconductor sampleZEISS CARL SMT GMBH·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 0967US6931619B2Apparatus for reshaping a patterned organic photoresist surfaceAPPLIED MATERIALS INC·Filed 2003·Granted Aug 16, 2005·7 cites·13 claims
- 1063US2023196189A1Measurement method and apparatus for semiconductor features with increased throughputZEISS CARL SMT GMBH·Filed 2022·Application pending·0 cites
- 1161US2025022680A13d volume inspection of semiconductor wafers with increased throughput and accuracyZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1260US11848172B2Method for measuring a sample and microscope implementing the methodZEISS CARL SMT GMBH·Filed 2021·Granted Dec 19, 2023·0 cites·25 claims
- 1360US2025069958A1Dual beam systems and methods for decoupling the working distance of a charged particle beam device from focused ion beam geometry induced constraintsZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1459US12288706B2Parameterizing x-ray scattering measurement using slice-and-image tomographic imaging of semiconductor structuresZEISS CARL SMT GMBH·Filed 2022·Granted Apr 29, 2025·0 cites·16 claims
- 1558US2024331179A13d volume inspection of semiconductor wafers with increased accuracyZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1657US2024311698A1Measurement method and apparatus for semiconductor features with increased throughputZEISS CARL SMT GMBH·Filed 2024·Application pending·0 cites
- 1753US7208249B2Method of producing a patterned photoresist used to prepare high performance photomasksAPPLIED MATERIALS INC·Filed 2002·Granted Apr 24, 2007·4 cites·18 claims
- 1853US2023267627A1Transferring alignment information in 3d tomography from a first set of images to a second set of imagesZEISS CARL SMT GMBH·Filed 2023·Application pending·0 cites
- 1951US12288705B2FIB-SEM 3D tomography for measuring shape deviations of HAR structuresZEISS CARL SMT GMBH·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 2047US7077973B2Methods for substrate orientationAPPLIED MATERIALS INC·Filed 2003·Granted Jul 18, 2006·4 cites·19 claims
- 2146US2022138973A1Cross section imaging with improved 3d volume image reconstruction accuracyZEISS CARL SMT GMBH·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →