Inventor · disambiguated record
Alexander Dulkin
Also filed as: DULKIN ALEXANDER
11 granted patents·385 citations·filing 2001–2021
91Inventor score
Top patents by PatentIndex Score
11 records- 0197US7922880B1Method and apparatus for increasing local plasma density in magnetically confined plasmaNOVELLUS SYSTEMS INC·Filed 2007·Granted Apr 12, 2011·67 cites·30 claims
- 0295US7645696B1Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layerNOVELLUS SYSTEMS INC·Filed 2006·Granted Jan 12, 2010·56 cites·24 claims
- 0395US6566246B1Deposition of conformal copper seed layers by control of barrier layer morphologyNOVELLUS SYSTEMS INC·Filed 2001·Granted May 20, 2003·147 cites·63 claims
- 0494US7964504B1PVD-based metallization methods for fabrication of interconnections in semiconductor devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 21, 2011·37 cites·42 claims
- 0594US7855147B1Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layerNOVELLUS SYSTEMS INC·Filed 2007·Granted Dec 21, 2010·39 cites·41 claims
- 0693US7745332B1PVD-based metallization methods for fabrication of interconnections in semiconductor devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Jun 29, 2010·24 cites·62 claims
- 0788US8449731B1Method and apparatus for increasing local plasma density in magnetically confined plasmaPRADHAN ANSHU A·Filed 2011·Granted May 28, 2013·10 cites·23 claims
- 0880US10153282B1Ultra-high vacuum transport and storageLAM RES CORP·Filed 2017·Granted Dec 11, 2018·3 cites·17 claims
- 0972US11239420B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2018·Granted Feb 1, 2022·1 cites·17 claims
- 1066US11832533B2Conformal damage-free encapsulation of chalcogenide materialsLAM RES CORP·Filed 2021·Granted Nov 28, 2023·0 cites·15 claims
- 1163US8343318B2Magnetic lensing to improve deposition uniformity in a physical vapor deposition (PVD) processNOVELLUS SYSTEMS INC·Filed 2010·Granted Jan 1, 2013·1 cites·32 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →