Inventor · disambiguated record
Aleksander Owczarz
Also filed as: OWCZARZ ALEKSANDER · OWCZARZ ALEKSANDER A
69 granted patents·4 pending applications·2,253 citations·filing 1987–2013
99Inventor score
Top patents by PatentIndex Score
73 records- 0198US7115023B1Process tape for cleaning or processing the edge of a semiconductor waferLAM RES CORP·Filed 2005·Granted Oct 3, 2006·42 cites·19 claims
- 0296US5377708AMulti-station semiconductor processor with volatilizationSEMITOOL INC·Filed 1993·Granted Jan 3, 1995·247 cites·83 claims
- 0396US5222310ASingle wafer processor with a frameSEMITOOL INC·Filed 1991·Granted Jun 29, 1993·219 cites·14 claims
- 0494US5235995ASemiconductor processor apparatus with dynamic wafer vapor treatment and particulate volatilizationSEMITOOL INC·Filed 1991·Granted Aug 17, 1993·168 cites·30 claims
- 0592US5224503ACentrifugal wafer carrier cleaning apparatusSEMITOOL INC·Filed 1992·Granted Jul 6, 1993·113 cites·55 claims
- 0692US5022419ARinser dryer systemSEMITOOL INC·Filed 1987·Granted Jun 11, 1991·99 cites·44 claims
- 0789US5409310ASemiconductor processor liquid spray system with additive blendingSEMITOOL INC·Filed 1993·Granted Apr 25, 1995·78 cites·31 claims
- 0888US7179154B1Method and apparatus for cleaning a wafer bevel edge and notch using a pin and an abrasive film cassetteLAM RES CORP·Filed 2005·Granted Feb 20, 2007·12 cites·19 claims
- 0988US5174045ASemiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriersSEMITOOL INC·Filed 1991·Granted Dec 29, 1992·117 cites·9 claims
- 1087US7138016B2Semiconductor processing apparatusSEMITOOL INC·Filed 2001·Granted Nov 21, 2006·31 cites·109 claims
- 1187US6808590B1Method and apparatus of arrayed sensors for metrological controlLAM RES CORP·Filed 2002·Granted Oct 26, 2004·31 cites·18 claims
- 1287US5431421ASemiconductor processor wafer holderSEMITOOL INC·Filed 1992·Granted Jul 11, 1995·108 cites·44 claims
- 1386US5445172AWafer holder with flexibly mounted gripping fingersSEMITOOL INC·Filed 1993·Granted Aug 29, 1995·73 cites·85 claims
- 1484US6520833B1Oscillating fixed abrasive CMP system and methods for implementing the sameLAM RES CORP·Filed 2000·Granted Feb 18, 2003·23 cites·22 claims
- 1583US7128803B2Integration of sensor based metrology into semiconductor processing toolsLAM RES CORP·Filed 2002·Granted Oct 31, 2006·28 cites·11 claims
- 1683US5232328ARobot loadable centrifugal semiconductor processor with extendible rotorSEMITOOL INC·Filed 1991·Granted Aug 3, 1993·87 cites·50 claims
- 1782US6579157B1Polishing pad ironing system and method for implementing the sameLAM RES CORP·Filed 2001·Granted Jun 17, 2003·19 cites·10 claims
- 1882US6386962B1Wafer carrier with groove for decoupling retainer ring from waterLAM RES CORP·Filed 2000·Granted May 14, 2002·27 cites·18 claims
- 1981US5156174ASingle wafer processor with a bowlSEMITOOL INC·Filed 1991·Granted Oct 20, 1992·77 cites·14 claims
- 2080US6929531B2System and method for metal residue detection and mapping within a multi-step sequenceLAM RES CORP·Filed 2002·Granted Aug 16, 2005·23 cites·24 claims
- 2180US6769961B1Chemical mechanical planarization (CMP) apparatusLAM RES CORP·Filed 2003·Granted Aug 3, 2004·20 cites·37 claims
- 2280US5738128ACentrifugal wafer carrier cleaning apparatusSEMITOOL INC·Filed 1996·Granted Apr 14, 1998·42 cites·24 claims
- 2380US5168887ASingle wafer processor apparatusSEMITOOL INC·Filed 1990·Granted Dec 8, 1992·73 cites·12 claims
- 2477US7752996B2Apparatus for applying a plating solution for electroless depositionLAM RES CORP·Filed 2006·Granted Jul 13, 2010·4 cites·9 claims
- 2577US5972127AMethods for centrifugally cleaning wafer carriersFiled 1997·Granted Oct 26, 1999·35 cites·38 claims
- 2677US5224841APneumatic bellows pump with supported bellows tubeSEMITOOL INC·Filed 1992·Granted Jul 6, 1993·44 cites·32 claims
- 2776US7542134B2System, method and apparatus for in-situ substrate inspectionLAM RES CORP·Filed 2008·Granted Jun 2, 2009·4 cites·9 claims
- 2876US6585572B1Subaperture chemical mechanical polishing systemLAM RES CORP·Filed 2000·Granted Jul 1, 2003·18 cites·22 claims
- 2975US9117860B2Controlled ambient system for interface engineeringBOYD JOHN·Filed 2006·Granted Aug 25, 2015·5 cites·13 claims
- 3074US5573023ASingle wafer processor apparatusSEMITOOL INC·Filed 1995·Granted Nov 12, 1996·34 cites·16 claims
- 3174US5562113ACentrifugal wafer carrier cleaning apparatusSEMITOOL INC·Filed 1993·Granted Oct 8, 1996·38 cites·57 claims
- 3273US7084621B2Enhancement of eddy current based measurement capabilitiesLAM RES CORP·Filed 2002·Granted Aug 1, 2006·10 cites·27 claims
- 3372US7625452B2Apparatuses and methods for cleaning a substrateLAM RES CORP·Filed 2008·Granted Dec 1, 2009·2 cites·7 claims
- 3471US5221360ASemiconductor processor methodsSEMITOOL INC·Filed 1992·Granted Jun 22, 1993·49 cites·20 claims
- 3571US5095927ASemiconductor processor gas-liquid separationSEMITOOL INC·Filed 1991·Granted Mar 17, 1992·48 cites·25 claims
- 3670US6937915B1Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and controlLAM RES CORP·Filed 2002·Granted Aug 30, 2005·11 cites·16 claims
- 3770US5154199ASemiconductor processor drainingSEMITOOL INC·Filed 1991·Granted Oct 13, 1992·40 cites·16 claims
- 3869US6808442B1Apparatus for removal/remaining thickness profile manipulationLAM RES CORP·Filed 2001·Granted Oct 26, 2004·12 cites·22 claims
- 3969US6561870B2Adjustable force applying air platen and spindle system, and methods for using the sameLAM RES CORP·Filed 2001·Granted May 13, 2003·12 cites·19 claims
- 4068US8314027B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2011·Granted Nov 20, 2012·2 cites·15 claims
- 4167US7309618B2Method and apparatus for real time metal film thickness measurementLAM RES CORP·Filed 2003·Granted Dec 18, 2007·10 cites·16 claims
- 4267US6925348B2Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and controlLAM RES CORP·Filed 2004·Granted Aug 2, 2005·9 cites·17 claims
- 4361US8485120B2Method and apparatus for wafer electroless platingTHIE WILLIAM·Filed 2007·Granted Jul 16, 2013·1 cites·14 claims
- 4461US7025854B2Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body systemLAM RES CORP·Filed 2003·Granted Apr 11, 2006·6 cites·9 claims
- 4560US7094291B2Semiconductor processing apparatusSEMITOOL INC·Filed 2001·Granted Aug 22, 2006·5 cites·54 claims
- 4658US6719874B1Active retaining ring supportLAM RES CORP·Filed 2001·Granted Apr 13, 2004·7 cites·16 claims
- 4757US8069813B2Wafer electroless plating system and associated methodsTHIE WILLIAM·Filed 2007·Granted Dec 6, 2011·1 cites·18 claims
- 4857US7205166B2Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film propertiesLAM RES CORP·Filed 2003·Granted Apr 17, 2007·8 cites·8 claims
- 4957US6896596B2Polishing pad ironing systemLAM RES CORP·Filed 2003·Granted May 24, 2005·5 cites·17 claims
- 5056US7441299B2Apparatuses and methods for cleaning a substrateLAM RES CORP·Filed 2004·Granted Oct 28, 2008·3 cites·19 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →