Inventor · disambiguated record
Andre Brockmeier
Also filed as: BROCKMEIER ANDRE
32 granted patents·7 pending applications·38 citations·filing 2012–2025
94Inventor score
Files withINFINEON TECHNOLOGIES AG33BREYMESSER ALEXANDER2INFINEON TECHNOLOGIES AUSTRIA AG2INFINEON TECHNOLOGIES AUSTRIA1VON KOBLINSKI CARSTEN1
Top patents by PatentIndex Score
39 records- 0189US11211459B2Semiconductor device and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 28, 2021·5 cites·14 claims
- 0283US10615040B2Superjunction structure in a power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 7, 2020·3 cites·11 claims
- 0383US2025376370A1Mems sensor with particle filter and method for producing itINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0482US9570542B2Semiconductor device including a vertical edge termination structure and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 14, 2017·4 cites·15 claims
- 0579US10276656B2Method of manufacturing semiconductor devices by using epitaxy and semiconductor devices with a lateral structureINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 30, 2019·2 cites·18 claims
- 0679US9503823B2Capacitive microphone with insulated conductive plateINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 22, 2016·5 cites·9 claims
- 0778US10112861B2Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of glass members in a glass substrateINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 30, 2018·1 cites·21 claims
- 0878US9601376B2Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portionINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 21, 2017·2 cites·23 claims
- 0975US8841768B2Chip package and a method for manufacturing a chip packageVON KOBLINSKI CARSTEN·Filed 2012·Granted Sep 23, 2014·5 cites·26 claims
- 1074US9847235B2Semiconductor device with plated lead frame, and method for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 19, 2017·3 cites·22 claims
- 1174US9219020B2Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devicesBREYMESSER ALEXANDER·Filed 2012·Granted Dec 22, 2015·3 cites·24 claims
- 1271US9981844B2Method of manufacturing semiconductor device with glass piecesBREYMESSER ALEXANDER·Filed 2012·Granted May 29, 2018·3 cites·6 claims
- 1369US11787686B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 1469US11180362B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 23, 2021·0 cites·14 claims
- 1569US11046577B2Method for processing a monocrystalline substrate and micromechanical structureINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 29, 2021·0 cites·8 claims
- 1667US2019023600A1Method of Manufacturing a Plurality of Glass Members, a Method of Manufacturing an Optical Member, and Array of Glass Members in a Glass SubstrateINFINEON TECHNOLOGIES AG·Filed 2018·Application pending·0 cites
- 1766US9385075B2Glass carrier with embedded semiconductor device and metal layers on the top surfaceINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 5, 2016·2 cites·21 claims
- 1865US12415719B2MEMS sensor with particle filter and method for producing itINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 16, 2025·0 cites·19 claims
- 1965US11990520B2Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 21, 2024·0 cites·21 claims
- 2065US2022293558A1Method for forming semiconductor devices using a glass structure attached to a wide band-gap semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2164US10403468B2Energy filter for processing a power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 3, 2019·0 cites·3 claims
- 2263US10766766B2Method for processing a layer structure and microelectromechanical componentINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 8, 2020·0 cites·13 claims
- 2362US10611630B2Method for processing a monocrystalline substrate and micromechanical structureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 7, 2020·0 cites·15 claims
- 2462US2017197865A1Mold, method for producing a mold, and method for forming a mold articleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Application pending·0 cites
- 2559US10242840B2Energy filter for processing a power semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Mar 26, 2019·0 cites·16 claims
- 2659US2015175467A1Mold, method for producing a mold, and method for forming a mold articleINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Application pending·0 cites
- 2757US2025091858A1Sandwich structures for microelectromechanical system micro-mirrorsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 2856US11502190B2Vertical power semiconductor device, semiconductor wafer or bare-die arrangement, carrier, and method of manufacturing a vertical power semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Nov 15, 2022·0 cites·28 claims
- 2955US12372780B23D dome wafer-level package for optical mems mirror with reduced footprintINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 29, 2025·0 cites·26 claims
- 3054US10049912B2Method of manufacturing a semiconductor device having a vertical edge termination structureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 14, 2018·0 cites·15 claims
- 3153US11393784B2Semiconductor package devices and method for forming semiconductor package devicesINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 19, 2022·0 cites·20 claims
- 3253US11148943B2Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass piecesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 19, 2021·0 cites·20 claims
- 3351US11939216B2Method with stealth dicing process for fabricating MEMS semiconductor chipsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Mar 26, 2024·0 cites·14 claims
- 3450US11576259B2Carrier, laminate and method of manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2019·Granted Feb 7, 2023·0 cites·18 claims
- 3549US10748787B2Semiconductor device with plated lead frameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 18, 2020·0 cites·15 claims
- 3648US9428381B2Devices with thinned waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Aug 30, 2016·0 cites·11 claims
- 3746US9439017B2Method for manufacturing a plurality of microphone structures, microphone and mobile deviceINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 6, 2016·0 cites·16 claims
- 3841US12060266B2Method with mechanical dicing process for producing MEMS componentsINFINEON TECHNOLOGIES AG·Filed 2021·Granted Aug 13, 2024·0 cites·21 claims
- 3941US2016332873A1Devices with thinned waferINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →