Inventor · disambiguated record
Ang Chan
Also filed as: CHAN ANG
8 granted patents·5 pending applications·3 citations·filing 2016–2024
75Inventor score
Top patents by PatentIndex Score
13 records- 0183US2025008743A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0280US12127413B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Oct 22, 2024·0 cites·9 claims
- 0377US10804461B1Manufacturing method of memory deviceUNITED MICROELECTRONICS CORP·Filed 2019·Granted Oct 13, 2020·3 cites·12 claims
- 0470US11004897B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted May 11, 2021·0 cites·7 claims
- 0566US11621296B2Magnetoresistive random access memory and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 4, 2023·0 cites·9 claims
- 0666US2024170299A1Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0764US12494456B2Semiconductor assembly and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 9, 2025·0 cites·9 claims
- 0858US11923205B2Method for manufacturing semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 5, 2024·0 cites·7 claims
- 0950US11482666B2Method for fabricating a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 1048US2024071988A1Method for manufacturing semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 1145US11145602B2Alignment mark structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 12, 2021·0 cites·13 claims
- 1236US2020185597A1Memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1330US2017186712A1Chip package and method for forming the sameXINTEC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →