Inventor · disambiguated record
Andrew Cross
Also filed as: CROSS ANDREW · CROSS ANDREW JAMES
10 granted patents·1 pending application·26 citations·filing 2016–2022
82Inventor score
Top patents by PatentIndex Score
11 records- 0191US10818001B2Using stochastic failure metrics in semiconductor manufacturingKLA TENCOR CORP·Filed 2019·Granted Oct 27, 2020·13 cites·20 claims
- 0286US10699926B2Identifying nuisances and defects of interest in defects detected on a waferKLA TENCOR CORP·Filed 2018·Granted Jun 30, 2020·7 cites·26 claims
- 0383US10262408B2System, method and computer program product for systematic and stochastic characterization of pattern defects identified from a semiconductor waferKLA TENCOR CORP·Filed 2017·Granted Apr 16, 2019·4 cites·19 claims
- 0469US10262831B2Method and system for weak pattern quantificationKLA TENCOR CORP·Filed 2017·Granted Apr 16, 2019·1 cites·31 claims
- 0563US10068323B2Aware system, method and computer program product for detecting overlay-related defects in multi-patterned fabricated devicesKLA TENCOR CORP·Filed 2016·Granted Sep 4, 2018·1 cites·19 claims
- 0657US12235224B2Process window qualification modulation layoutsKLA CORP·Filed 2022·Granted Feb 25, 2025·0 cites·4 claims
- 0756US11092893B2Inspection sensitivity improvements for optical and electron beam inspectionKLA CORP·Filed 2019·Granted Aug 17, 2021·0 cites·13 claims
- 0854US12066763B2Sensitivity improvement of optical and SEM defection inspectionKLA CORP·Filed 2021·Granted Aug 20, 2024·0 cites·45 claims
- 0946US2022270212A1Methods for improving optical inspection and metrology image quality using chip design dataKLA CORP·Filed 2022·Application pending·0 cites
- 1041US10598617B2Metrology guided inspection sample shaping of optical inspection resultsKLA TENCOR CORP·Filed 2017·Granted Mar 24, 2020·0 cites·16 claims
- 1138US10957608B2Guided scanning electron microscopy metrology based on wafer topographyKLA TENCOR CORP·Filed 2017·Granted Mar 23, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →