Inventor · disambiguated record
Anh Duong
Also filed as: DUONG ANH · DUONG ANH N · DUONG ANH NGOC
36 granted patents·7 pending applications·220 citations·filing 1993–2022
96Inventor score
Top patents by PatentIndex Score
43 records- 0196US9012322B2Selective etching of copper and copper-barrier materials by an aqueous base solution with fluoride additionINTERMOLECULAR INC·Filed 2013·Granted Apr 21, 2015·30 cites·17 claims
- 0295US11431280B2System and method for improving color appearance of solar roofsTESLA INC·Filed 2019·Granted Aug 30, 2022·62 cites·8 claims
- 0393US9123785B1Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/HCI solutionINTERMOLECULAR INC·Filed 2014·Granted Sep 1, 2015·12 cites·20 claims
- 0493US7919446B1Post-CMP cleaning compositions and methods of using sameINTERMOLECULAR INC·Filed 2008·Granted Apr 5, 2011·21 cites·7 claims
- 0586US8518765B1Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residuesDUONG ANH·Filed 2012·Granted Aug 27, 2013·5 cites·18 claims
- 0682US7879710B2Substrate processing including a masking layerINTERMOLECULAR INC·Filed 2006·Granted Feb 1, 2011·6 cites·13 claims
- 0779US9245848B2Methods for coating a substrate with an amphiphilic compoundINTERMOLECULAR INC·Filed 2014·Granted Jan 26, 2016·3 cites·15 claims
- 0879US8575021B2Substrate processing including a masking layerINTERMOLECULAR INC·Filed 2013·Granted Nov 5, 2013·4 cites·16 claims
- 0978US8449681B2Composition and method for removing photoresist and bottom anti-reflective coating for a semiconductor substrateDUONG ANH·Filed 2010·Granted May 28, 2013·3 cites·14 claims
- 1078US6911411B2Catalyst agglomerates for membrane electrode assembliesPOLYFUEL INC·Filed 2002·Granted Jun 28, 2005·33 cites·27 claims
- 1175US9337030B2Method to grow in-situ crystalline IGZO using co-sputtering targetsINTERMOLECULAR INC·Filed 2014·Granted May 10, 2016·3 cites·17 claims
- 1273US8853081B2High dose ion-implanted photoresist removal using organic solvent and transition metal mixturesINTERMOLECULAR INC·Filed 2012·Granted Oct 7, 2014·3 cites·20 claims
- 1371US9343408B2Method to etch Cu/Ta/TaN selectively using dilute aqueous HF/H2SO4 solutionINTERMOLECULAR INC·Filed 2013·Granted May 17, 2016·2 cites·15 claims
- 1469US8426970B2Substrate processing including a masking layerFRESCO ZACHARY·Filed 2010·Granted Apr 23, 2013·2 cites·10 claims
- 1569US5474625ADesensitized solid rocket propellant formulationUS ARMY·Filed 1993·Granted Dec 12, 1995·23 cites·10 claims
- 1668US11955921B2System and method for improving color appearance of solar roofsTESLA INC·Filed 2022·Granted Apr 9, 2024·0 cites·12 claims
- 1768US9224639B2Method to etch cu/Ta/TaN selectively using dilute aqueous Hf/hCl solutionINTERMOLECULAR INC·Filed 2015·Granted Dec 29, 2015·1 cites·21 claims
- 1868US8871860B2Methods for coating a substrate with an amphiphilic compoundINTERMOLECULAR INC·Filed 2013·Granted Oct 28, 2014·1 cites·14 claims
- 1966US9214436B2Etching of under bump mettallization layer and resulting deviceGLOBALFOUNDRIES INC·Filed 2014·Granted Dec 15, 2015·2 cites·11 claims
- 2064US8513117B2Process to remove Ni and Pt residues for NiPtSi applicationsDUONG ANH·Filed 2011·Granted Aug 20, 2013·2 cites·20 claims
- 2161US9399753B2Aqua regia and hydrogen peroxide HCL combination to remove Ni and NiPt residuesINTERMOLECULAR INC·Filed 2014·Granted Jul 26, 2016·0 cites·13 claims
- 2259US8946015B2Aqua regia and hydrogen peroxide HCI combination to remove Ni and NiPt residuesINTERMOLECULAR INC·Filed 2014·Granted Feb 3, 2015·0 cites·20 claims
- 2358US8809140B2Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residuesINTERMOLECULAR INC·Filed 2013·Granted Aug 19, 2014·0 cites·19 claims
- 2456US8926758B2Composition and method for removing photoresist and bottom anti-reflective coating for a semiconductor substrateINTERMOLECULAR INC·Filed 2013·Granted Jan 6, 2015·0 cites·17 claims
- 2556US8664014B2High productivity combinatorial workflow for photoresist strip applicationsLI BEI·Filed 2011·Granted Mar 4, 2014·1 cites·20 claims
- 2654US8833454B2Hydrocarbon recovery methodDUONG ANH NGOC·Filed 2010·Granted Sep 16, 2014·1 cites·17 claims
- 2753US8859431B2Process to remove Ni and Pt residues for NiPtSi application using chlorine gasINTERMOLECULAR INC·Filed 2013·Granted Oct 14, 2014·0 cites·20 claims
- 2853US2013244186A1Composition And Method For Removing Photoresist And Bottom Anti-Reflective Coating For A Semiconductor SubstrateINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 2952US8076240B2Techniques to improve characteristics of processed semiconductor substratesDUONG ANH NGOC·Filed 2008·Granted Dec 13, 2011·0 cites·10 claims
- 3050US8252685B2Techniques to improve characteristics of processed semiconductor substratesDUONG ANH NGOC·Filed 2011·Granted Aug 28, 2012·0 cites·10 claims
- 3149US8466058B2Process to remove Ni and Pt residues for NiPtSi applications using chlorine gasDUONG ANH·Filed 2011·Granted Jun 18, 2013·0 cites·17 claims
- 3248US8535972B2Methods for coating a substrate with an amphiphilic compoundFRESCO ZACHARY M·Filed 2008·Granted Sep 17, 2013·0 cites·15 claims
- 3348US7884036B1Methods for treating substrates in preparation for subsequent processesINTERMOLECULAR INC·Filed 2007·Granted Feb 8, 2011·0 cites·18 claims
- 3447US8784572B2Method for cleaning platinum residues on a semiconductor substrateDUONG ANH·Filed 2011·Granted Jul 22, 2014·0 cites·11 claims
- 3546US2018327661A1Silicone copolymers as emulsification additives for quantum dot resin premixNANOSYS INC·Filed 2018·Application pending·0 cites
- 3646US2016163551A1Methods of forming metal silicide regions on semiconductor devices using an organic chelating material during a metal etch processGLOBALFOUNDRIES INC·Filed 2014·Application pending·0 cites
- 3746US2013125923A1Method for cleaning platinum residues on a semiconductor substrateINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 3842US8894774B2Composition and method to remove excess material during manufacturing of semiconductor devicesDUONG ANH·Filed 2011·Granted Nov 25, 2014·0 cites·20 claims
- 3942US8697573B2Process to remove Ni and Pt residues for NiPtSi applications using aqua regia with microwave assisted heatingDUONG ANH·Filed 2011·Granted Apr 15, 2014·0 cites·11 claims
- 4041US9159683B2Methods for etching copper during the fabrication of integrated circuitsGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 13, 2015·0 cites·14 claims
- 4141US2016043046A1Etching of under bump metallization layer and resulting deviceGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
- 4241US2015017456A1Reducing voids caused by trapped acid on a dielectric surfaceINTERMOLECULAR INC·Filed 2013·Application pending·0 cites
- 4338US2014248770A1Microwave-assisted heating of strong acid solution to remove nickel platinum/platinum residuesGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →