Inventor · disambiguated record
Aniruddha Joi
Also filed as: JOI ANIRUDDHA
14 granted patents·6 pending applications·31 citations·filing 2014–2025
88Inventor score
Files withLAM RES CORP20
Top patents by PatentIndex Score
20 records- 0195US10163695B1Self-forming barrier processLAM RES CORP·Filed 2017·Granted Dec 25, 2018·7 cites·23 claims
- 0292US9469902B2Electroless deposition of continuous platinum layerLAM RES CORP·Filed 2014·Granted Oct 18, 2016·13 cites·26 claims
- 0389US10483163B2Self-forming barrier processLAM RES CORP·Filed 2018·Granted Nov 19, 2019·2 cites·21 claims
- 0486US12278112B2Multiple state pulsing for high aspect ratio etchLAM RES CORP·Filed 2022·Granted Apr 15, 2025·1 cites·25 claims
- 0583US10501846B2Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatmentLAM RES CORP·Filed 2017·Granted Dec 10, 2019·4 cites·11 claims
- 0673US9428836B2Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agentsLAM RES CORP·Filed 2014·Granted Aug 30, 2016·3 cites·20 claims
- 0765US2025210364A1Multiple State Pulsing for High Aspect Ratio EtchLAM RES CORP·Filed 2025·Application pending·0 cites
- 0863US9499913B2Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agentLAM RES CORP·Filed 2014·Granted Nov 22, 2016·1 cites·20 claims
- 0962US11424158B2Metal liner passivation and adhesion enhancement by zinc dopingLAM RES CORP·Filed 2020·Granted Aug 23, 2022·0 cites·32 claims
- 1060US10508351B2Layer-by-layer deposition using hydrogenLAM RES CORP·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 1154US11225714B2Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatmentLAM RES CORP·Filed 2019·Granted Jan 18, 2022·0 cites·19 claims
- 1254US2015307994A1ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTSLAM RES CORP·Filed 2014·Application pending·0 cites
- 1350US11984354B2Zincating and doping of metal liner for liner passivation and adhesion improvementLAM RES CORP·Filed 2019·Granted May 14, 2024·0 cites·20 claims
- 1450US9476124B2Selective deposition and co-deposition processes for ferromagnetic thin filmsLAM RES CORP·Filed 2015·Granted Oct 25, 2016·0 cites·19 claims
- 1550US2025308919A1Simultaneous dielectric etch with metal passivationLAM RES CORP·Filed 2023·Application pending·0 cites
- 1650US2024120209A1Systems and methods for etching a high aspect ratio structureLAM RES CORP·Filed 2021·Application pending·0 cites
- 1749US10741440B2Metal liner passivation and adhesion enhancement by zinc dopingLAM RES CORP·Filed 2018·Granted Aug 11, 2020·0 cites·20 claims
- 1848US10640874B2Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage biasLAM RES CORP·Filed 2018·Granted May 5, 2020·0 cites·20 claims
- 1942US2017073815A1Method for a non-aqueous electroless polyol deposition of metal or metal alloy in features of a substrateLAM RES CORP·Filed 2015·Application pending·0 cites
- 2042US2015307995A1ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTSLAM RES CORP·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →